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Home
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Raw materials & consumables
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Thermal Management
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Heat Sinks
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HEAT SINK: MATERIAL:AL 6063 & CU CORE
HEAT SINK: MATERIAL:AL 6063 & CU CORE
HEAT SINK: MATERIAL:AL 6063 & CU CORE
Specifications
Brand
ADLINK
Schedule B
8473300002
SKU:
INTEL FOR LGA 775 TM
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HEAT SINK: MATERIAL:AL 6063 & CU CORE
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