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SRAM Chip Async Single 2.5V/3V 16M-Bit 1M x 16 45ns 48-Pin VFBGA Tray

CY62167G high-performance CMOS, low-power (MoBL) SRAM devices with embedded ECC. Both devices are offered in single and dual chip enable options and in multiple pin configurations. To access devices with a single chip enable input, assert the chip enable (CE\) input LOW. To access dual chip enable devices, assert both chip enable inputs - CE1\ as LOW and CE2 as HIGH. To perform data writes, assert the Write Enable (WE\) input LOW, and provide the data and address on the device data pins (I/O0 through I/O15) and address pins (A0 through A19) respectively. The Byte High Enable (BHE\) and Byte Low Enable (BLE\) inputs control byte writes and write data on the corresponding I/O lines to the memory location specified. BHE\ controls I/O8 through I/O15 and BLE\ controls I/O0 through I/O7. To perform data reads, assert the Output Enable (OE\) input and provide the required address on the address lines. You can access read data on the I/O lines (I/O0 through I/O15). To perform byte accesses, assert the required byte enable signal (BHE\ or BLE\) to read either the upper byte or the lower byte of data from the specified address location. All I/Os (I/O0 through I/O15) are placed in a high-impedance state when the device is deselected (CE\ HIGH for a single chip enable device and CE1\ HIGH / CE2 LOW for a dual chip enable device), or the control signals are de-asserted (OE\, BLE\, BHE\). These devices have a unique Byte Power-down feature where, if both the Byte Enables (BHE\ and BLE\) are disabled, the devices seamlessly switch to the standby mode irrespective of the state of the chip enables, thereby saving power.The CY62167G device is available in a Pb-free 48-pin TSOP package and 48-ball VFBGA packages. The device in the 48-pin TSOP package can also be configured to function as a 2 M words × 8 bit device.
  • Ultra-low standby current
    • Typical standby current: 5.5 µA
    • Maximum standby current: 16 µA
  • High speed: 45 ns / 55 ns
  • Wide voltage range: 1.65 V to 2.2 V, 2.2 V to 3.6 V, and 4.5 Vto 5.5 V
  • 1.0-V data retention
  • Transistor-transistor logic (TTL) compatible inputs and outputs
  • Error indication (ERR) pin to indicate 1-bit error detection andcorrection
  • 48-pin TSOP I package configurable as 1 M × 16 or 2 M × 8SRAM
  • Available in Pb-free 48-ball VFBGA and 48-pin TSOP Ipackages

Especificações

Brand Rochester Electronics
Datasheet PDF
Timing Type Asynchronous
Number Of Words 1 MWords
Density 16 Mbit
Operating temperature -40 to 85 °C
Pin Count 48
Number Of Ports 1
Mounting Surface Mount
Address B 20 Bit
Number Of 16 Bit
Number Of 16 Bit
Maximum O 36 mA
Product description 6 x 8 x 0.79(Max)
Maximum R 45 ns
Supplier VFBGA
Typical O 2.5, 3 V
ECCN 3A991.B.2.B
Schedule B 8542320070
HTSN 8542320041
Country of origin United States
Screening Level Industrial
Minimum O 2.2 V
Maximum O 3.6 V
Lead Finish Tin|Silver|Copper
Max Proce 260
Msl Level 3
SKU: CY62167G30-45BVXI