Heat Sink Passive BGA Radial
Bond-on heat sink for leadless chip carriers and flat packs.Primarily designed for 68-position devices.
Width: 28.58
Length: 28.58
Height: 0.00
Finish: Black Anodize
Width: 28.58
Length: 28.58
Height: 0.00
Finish: Black Anodize
Especificações
| Brand | Aavid |
|---|---|
| Device Cooled | BGA |
| Product diameter | 28.58 mm |
| Product description | mm |
| Type Prod | Passive |
| Fin Style | Radial |
| Schedule B | 8541900000 |
| HTSN | 8541900000 |
| Country of origin | United States |
| Lead Finish | Matte Tin |
SKU: 2292BG