Combo Mem 1.8V 168-Pin WFBGA

Micron package-on-a-package (PoP) products combine NAND Flash and LP-DRAM devices in a single multichip package (MCP). These products target mobile applications with low-power, high-performance, and minimal package-footprint design requirements. The NAND Flash and LP-DRAM devices are also members of the Micron discrete memory products portfolio. The NAND Flash and LP-DRAM devices are packaged with separate interfaces (no shared address, control, data, or power balls). This bus architecture supports an optimized interface to processors with separate NAND Flash and LP-DRAM buses. The NAND Flash and LP-DRAM devices have separate core power connections and share a common ground (i.e., Vss is tied together on the two devices). The bus architecture of this device also supports separate NAND Flash and LP-DRAM functionality without concern for device interaction.

• Micron® NAND Flash and LPDRAM components
• RoHS-compliant, “green” package
• Separate NAND Flash and LPDRAM interfaces
• Space-saving multichip package/package-on-package combination
• Low-voltage operation (1.70–1.95V)
• Industrial temperature range: –40°C to +85°C