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SRAM Chip Async Single 3.3V 8M-Bit 512K x 16 70ns 48-Pin FBGA

The CY62157CV33 are high-performance CMOS static RAMs organized as 512K words by 16 bits. These devices feature advanced circuit design to provide ultra-low active current. This is ideal for providing More Battery Life (MoBL) in portable applications such as cellular telephones. The devices also have an automatic power-down feature that significantly reduces power consumption by 80% when addresses are not toggling. The device can also be put into standby mode reducing power consumption by more than 99% when deselected. The input/output pins are placed in a high-impedance state when: deselected, outputs are disabled, both Byte High Enable and Byte Low Enable are disabled, or during a write operation. Writing to the device is accomplished by taking Chip Enable 1 and Write Enable inputs LOW and Chip Enable 2 HIGH. If Byte Low Enable is LOW, then data from I/O pins, is written into the location specified on the address pins. If Byte High Enable is LOW, then data from I/O pins is written into the location specified on the address pins. Reading from the device is accomplished by taking Chip Enable 1 and Output Enable LOW and Chip Enable 2 HIGH while forcing the Write Enable HIGH. If Byte Low Enable is LOW, then data from the memory location specified by the address pins will appear on I/O0 to I/O7. If Byte High Enable is LOW, then data from memory will appear on I/O8 to I/O15. See the truth table at the back of this data sheet for a complete description of read and write modes.
  • Temperature Ranges
    • Automotive-A: -40°C to 85°C
    • Automotive-E: -40°C to 125°C
  • Voltage range:
    • CY62157CV30: 2.7V-3.3V
    • CY62157CV33: 3.0V-3.6V
  • Ultra-low active power
    • Typical active current: 1.5 mA @ f = 1 MHz
    • Typical active current: 5.5 mA @ f = fmax
  • Low standby power
  • Easy memory expansion with CE/ and OE1/, CE/ and OE2/ and features
  • Automatic power-down when deselected
  • CMOS for optimum speed/power
  • Available in Pb-free and non Pb-free 48-ball FBGA package

Мүнözдөмөлөр

Бренд Rochester Electronics
Datasheet PDF
Timing Type Asynchronous
Number Of Words 512 kWords
Density 8 Mb
Рабочая температура -40 to 85 °C
Pin Count 48
Number Of Ports 1
Mounting Surface Mount
Address B 19 Bit
Number Of 16 Bit
Number Of 16 Bit
Maximum O 12 mA
Описание продукта 10 x 6 x 0.89 mm
Maximum R 70 ns
Supplier FBGA
Typical O 3.3000 V
ECCN 3A991.B.2.A
Schedule B 8542320040
HTSN 8542320041
Страна происхождения United States
Screening Level Industrial
Minimum O 3 V
Maximum O 3.6 V
Lead Finish Tin/Lead/Silver|Tin/Lead
Max Proce 235
Msl Level 3
SKU: CY62157CV33LL-70BAI