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SRAM Chip Sync Dual 2.5V 18M-Bit 1M x 18 3.4ns 100-Pin TQFP

The CY7C1372DV25 is a 2.5 V, 512 K × 36 and 1-Mbit × 18 synchronous pipelined burst SRAMs with No Bus Latency (NoBLä) logic, respectively. They are designed to support unlimited true back-to-back read/write operations with no wait states. TheCY7C1372DV25 is a equipped with the advanced NoBL logic required to enable consecutive read/write operations with data being transferred on every clock cycle. This feature dramatically improves the throughput of data in systems that require frequent write/read transitions. The CY7C1372DV25 is a pin-compatible and functionally equivalent to ZBT devices. All synchronous inputs pass through input registers controlled by the rising edge of the clock. All data outputs pass through output registers controlled by the rising edge of the clock. The clock input is qualified by the clock enable (CEN) signal, which when deasserted suspends operation and extends the previous clock cycle. Write operations are controlled by the byte write selects (BWa–BWd for CY7C1372DV25 and BWa–BWb for CY7C1372DV25) and a write enable (WE) input. All writes are conducted with on-chip synchronous self-timed write circuitry. Three synchronous chip enables (CE1, CE2, CE3) and an asynchronous output enable (OE) provide for easy bank selection and output three-state control. In order to avoid bus contention, the output drivers are synchronously three-stated during the data portion of a write sequence.
  • Pin-compatible and functionally equivalent to ZBT™
  • Supports 200-MHz bus operations with zero wait states
  • Available speed grades are 200 and 167 MHz
  • Internally self-timed output buffer control to eliminate the need to use asynchronous OE
  • Fully registered (inputs and outputs) for pipelined operation
  • Byte write capability
  • Single 2.5 V core power supply (VDD)
  • 2.5 V I/O power supply (VDDQ)
  • Fast clock-to-output times
  • 3.0 ns (for 200-MHz device)
  • Clock enable (CEN) pin to suspend operation
  • Synchronous self-timed writes
  • Available in JEDEC-standard Pb-free 100-pin TQFP, and non Pb-free 165-ball FBGA packages
  • IEEE 1149.1 JTAG-compatible boundary scan
  • Burst capability - linear or interleaved burst order
  • “ZZ” sleep mode option and stop clock option

仕様

Brand Rochester Electronics
Datasheet PDF
Timing Type Synchronous
Number Of Words 1 MWords
Density 18 Mb
Operating temperature 0 to 70 °C
Pin Count 100
Number Of Ports 2
Mounting Surface Mount
Address B 20 Bit
Number Of 18 Bit
Number Of 18 Bit
Maximum O 275 mA
Product description 20 x 14 x 1.4 mm
Maximum R 3.4 ns
Supplier TQFP
Typical O 2.5000 V
ECCN 3A991.B.2.A
Schedule B 8542320040
HTSN 8542320041
Country of origin United States
Screening Level Commercial
Minimum O 2.375 V
Maximum O 2.625 V
Maximum C 167 MHz
Data Rate SDR
Architecture Pipelined
Lead Finish Matte Tin|Gold
Max Proce 260
Msl Level 3
SKU: CY7C1372DV25-167AXC