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SRAM Chip Sync Dual 1.8V 36M-Bit 2M x 18 0.45ns 165-Pin FBGA Tray

The CY7C1423KV18 is 1.8 V synchronous pipelined SRAMs, equipped with DDR II SIO (double data rate separate I/O) architecture. The DDR II SIO consists of two separate ports: the read port and the write port to access the memory array. The read port has data outputs to support read operations and the write port has data inputs to support write operations. The DDR II SIO has separate data inputs and data outputs to completely eliminate the need to “turnaround” the data bus required with common I/O devices. Access to each port is accomplished through a common address bus. Addresses for read and write are latched on alternate rising edges of the input (K) clock. Write data is registered on the rising edges of both K and K. Read data is driven on the rising edges of C and C if provided, or on the rising edge of K and K if C/C are not provided. Each address location is associated with two 18-bit words in the case of CY7C1423KV18 that burst sequentially into or out of the device. Asynchronous inputs include an output impedance matching input (ZQ). Synchronous data outputs are tightly matched to the two output echo clocks CQ/CQ, eliminating the need to capture data separately from each individual DDR II SIO SRAM in the system design. Output data clocks (C/C) enable maximum system clocking and data synchronization flexibility. All synchronous inputs pass through input registers controlled by the K or K input clocks. All data outputs pass through output registers controlled by the C or C (or K or K in a single clock domain) input clocks. Writes are conducted with on-chip synchronous self-timed write circuitry.
  • 36 Mbit density (4 M × 8, 4 M × 9, 2 M × 18, 1 M × 36)
  • 333 MHz clock for high bandwidth
  • 2-word burst for reducing address bus frequency
  • Double data rate (DDR) interfaces (data transferred at 666 MHz) at 333 MHz
  • Two input clocks (K and K) for precise DDR timing
    • SRAM uses rising edges only
  • Two input clocks for output data (C and C) to minimize clock skew and flight time mismatches
  • Echo clocks (CQ and CQ) simplify data capture in high speed systems
  • Synchronous internally self timed writes
  • DDR II operates with 1.5 cycle read latency when DOFF is asserted HIGH
  • Operates similar to DDR I device with 1 cycle read latency when DOFF is asserted LOW
  • 1.8 V core power supply with HSTL inputs and outputs
  • Variable drive HSTL output buffers
  • Expanded HSTL output voltage (1.4 V to VDD)
    • Supports both 1.5 V and 1.8 V IO supply
  • Available in 165-ball FBGA package (13 × 15 × 1.4 mm)
  • Offered in both Pb-free and non Pb-free packages
  • JTAG 1149.1 compatible test access port
  • Phase locked loop (PLL) for accurate data placement

仕様

Brand Rochester Electronics
Datasheet PDF
Timing Type Synchronous
Number Of Words 2 MWords
Density 36 Mb
Operating temperature 0 to 70 °C
Pin Count 165
Number Of Ports 2
Mounting Surface Mount
Address B 20 Bit
Number Of 18 Bit
Number Of 18 Bit
Maximum O 490 mA
Product description 15 x 13 x 0.89 mm
Maximum R 0.45 ns
Supplier FBGA
Typical O 1.8000 V
ECCN 3A991.B.2.A
Schedule B 8542320040
HTSN 8542320041
Country of origin United States
Screening Level Commercial
Minimum O 1.7 V
Maximum O 1.9 V
Maximum C 333 MHz
Data Rate DDR
Architecture Pipelined
Lead Finish Tin/Silver/Copper
Max Proce 260
Msl Level 3
SKU: CY7C1423KV18-333BZXC