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SRAM Chip Sync Dual 1.8V 144M-Bit 8M x 18 0.45ns 165-Pin FBGA

The GS81302DT19E is a built in compliance with the Sigma Quad-II+ SRAM pin out standard for Separate I/O synchronous SRAMs. They are 150,994,944-bit (144Mb) SRAMs. The GS81302DT19E Sigma Quad SRAMs are just one element in a family of low power, low voltage HSTL I/O SRAMs designed to operate at the speeds needed to implement economical high performance networking systems.Clocking and Addressing Schemes: The GS81302DT19E Sigma Quad-II+ SRAMs are synchronous devices. They employ two input register clock inputs, K and K. K and K are independent single-ended clock inputs, not differential inputs to a single differential clock input buffer.Each internal read and write operation in a Sigma Quad-II+ B4 RAM is four times wider than the device I/O bus. An input data bus de-multiplexer is used to accumulate incoming data before it is simultaneously written to the memory array. An output data multiplexer is used to capture the data produced from a single memory array read and then route it to the appropriate output drivers as needed. Therefore the address field of a Sigma Quad-II+ B4 RAM is always two address pins less than the advertised index depth (e.g., the 16M x 8 has a 4M addressable index).
  • 2.0 clock Latency
  • Simultaneous Read and Write Sigma Quad™ Interface
  • JEDEC-standard pinout and package
  • Dual Double Data Rate interface
  • Byte Write controls sampled at data-in time
  • Burst of 4 Read and Write
  • Dual-Range On-Die Termination (ODT) on Data (D), Byte Write (BW), and Clock (K, K) inputs
  • 1.8 V +100/–100 mV core power supply
  • 1.5 V or 1.8 V HSTL Interface
  • Pipelined read operation
  • Fully coherent read and write pipelines
  • ZQ pin for programmable output drive strength
  • Data Valid Pin (QVLD) Support
  • IEEE 1149.1 JTAG-compliant Boundary Scan
  • 165-bump, 15 mm x 17 mm, 1 mm bump pitch BGA package
  • RoHS-compliant 165-bump BGA package available

仕様

Brand GSI Technology
Datasheet PDF
Timing Type Synchronous
Number Of Words 8 MWords
Density 144 Mbit
Operating temperature 0 to 85 °C
Pin Count 165
Number Of Ports 2
Mounting Surface Mount
Address B 21 Bit
Number Of 18 Bit
Number Of 18 Bit
Maximum O 940 mA
Product description 17 x 15 x 1.04 mm
Maximum R 0.45 ns
Supplier FBGA
Typical O 1.8000 V
ECCN 3A991.B.2.B
Schedule B 8542320040
HTSN 8542320041
Country of origin Taiwan
Screening Level Commercial
Minimum O 1.7 V
Maximum O 1.9 V
Maximum C 350 MHz
Data Rate QDR
Architecture Pipelined
SKU: GS81302DT19E-350