वस्तु और कच्चा माल व्यापार मंच

SRAM Chip Sync Dual 1.8V 18M-Bit 1M x 18 0.45ns 165-Pin FBGA Tray

The CY7C1312KV18 is 1.8 V Synchronous Pipelined SRAMs, equipped with QDR II architecture. QDR II architecture consists of two separate ports: the read port and the write port to access the memory array. The read port has dedicated data outputs to support read operations and the write port has dedicated data inputs to support write operations. QDR II architecture has separate data inputs and data outputs to completely eliminate the need to ‘turnaround’ the data bus that exists with common I/O devices. Access to each port is through a common address bus. Addresses for read and write addresses are latched on alternate rising edges of the input (K) clock.
  • Separate independent read and write data ports
    • Supports concurrent transactions
  • 333 MHz clock for high bandwidth
  • Two-word burst on all accesses
  • Double-data rate (DDR) interfaces on both read and write ports (data transferred at 666 MHz) at 333 MHz
  • Two input clocks (K and K) for precise DDR timing
    • SRAM uses rising edges only
  • Two input clocks for output data (C and C) to minimize clock skew and flight time mismatches
  • Echo clocks (CQ and CQ) simplify data capture in high-speed systems
  • Single multiplexed address input bus latches address inputs for both read and write ports
  • Separate port selects for depth expansion
  • Synchronous internally self-timed writes
  • QDR® II operates with 1.5 cycle read latency when DOFF is asserted HIGH
  • Operates similar to QDR I device with one cycle read latency when DOFF is asserted LOW
  • Available in × 18, and × 36 configurations
  • Full data coherency, providing most current data
  • Core VDD = 1.8 V (±0.1 V); I/O VDDQ = 1.4 V to VDD
    • Supports both 1.5 V and 1.8 V I/O supply
  • Available in 165-ball FBGA package (13 × 15 × 1.4 mm)
  • Offered in both Pb-free and non Pb-free packages
  • Variable drive HSTL output buffers
  • JTAG 1149.1 compatible test access port
  • PLL for accurate data placement

Specifications

Brand Rochester Electronics
Datasheet PDF
Timing Type Synchronous
Number Of Words 1 MWords
Density 18 Mb
Operating temperature 0 to 70 °C
Pin Count 165
Number Of Ports 2
Mounting Surface Mount
Address B 19 Bit
Number Of 18 Bit
Number Of 18 Bit
Maximum O 640 mA
Product description 15 x 13 x 0.89 mm
Maximum R 0.45 ns
Supplier FBGA
Typical O 1.8000 V
ECCN 3A991.B.2.A
Schedule B 8542320040
HTSN 8542320041
Country of origin United States
Screening Level Commercial
Minimum O 1.7 V
Maximum O 1.9 V
Maximum C 300 MHz
Data Rate QDR
Architecture Pipelined
Lead Finish Tin/Silver/Copper
Max Proce 260
Msl Level 3
SKU: CY7C1312KV18-300BZXC