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SRAM Chip Sync Single 2.5V/3.3V 9M-Bit 512K x 18 5ns/2.5ns 165-Pin FBGA Tray

The GS88118C is a 9,437,184-bit high performance synchronous SRAM with a 2-bit burst address counter. Although of a type originally developed for Level 2 Cache applications supporting high performance CPUs, the device now finds application in synchronous SRAM applications, ranging from DSP main store to networking chip set support.Controls: Addresses, data I/Os, chip enable (E1, E2), address burst control inputs (ADSP, ADSC, ADV) and write control inputs (Bx, BW, GW) are synchronous and are controlled by a positive-edge-triggered clock input (CK). Output enable (G) and power down control (ZZ) are asynchronous inputs. Burst cycles can be initiated with either ADSP or ADSC inputs. In Burst mode, subsequent burst addresses are generated internally and are controlled by ADV. The burst address counter may be configured to count in either linear or interleave order with the Linear Burst Order (LBO) input. The Burst function need not be used. New addresses can be loaded on every cycle with no degradation of chip performance.Flow Through/Pipeline Reads: The function of the Data Output register can be controlled by the user via the FT mode pin (Pin 14). Holding the FT mode pin low places the RAM in Flow Through mode, causing output data to bypass the Data Output Register. Holding FT high places the RAM in Pipeline mode, activating the rising-edge-triggered Data Output Register.SCD Pipelined Reads: The GS88118C is a SCD (Single Cycle Deselect) pipelined synchronous SRAM. DCD (Dual Cycle Deselect) versions are also available. SCD SRAMs pipeline deselect commands one stage less than read commands. SCD RAMs begin turning off their outputs immediately after the deselect command has been captured in the input registers.Byte Write and Global Write: Byte write operation is performed by using Byte Write enable (BW) input combined with one or more individual byte write signals (Bx). In addition, Global Write (GW) is available for writing all bytes at one time, regardless of the Byte Write control inputs.Sleep Mode: Low power (Sleep mode) is attained through the assertion (High) of the ZZ signal, or by stopping the clock (CK). Memory data is retained during Sleep mode.Core and Interface Voltages: The GS88118C operates on a 2.5 V or 3.3 V power supply. All input are 3.3 V and 2.5 V compatible. Separate output power (VDDQ) pins are used to decouple output noise from the internal circuits and are 3.3 V and 2.5 V compatible.
  • IEEE 1149.1 JTAG-compatible Boundary Scan
  • 2.5 V or 3.3 V +10%/–10% core power supply
  • 2.5 V or 3.3 V I/O supply
  • LBO pin for Linear or Interleaved Burst mode
  • Internal input resistors on mode pins allow floating mode pins
  • Byte Write (BW) and/or Global Write (GW) operation
  • Internal self-timed write cycle
  • Automatic power-down for portable applications
  • JEDEC-standard 100-lead TQFP and 165-bump BGA packages
  • 4th Generation, Green 13 mm x 15 mm, 165 FPBGA

Caractéristiques

Brand GSI Technology
Datasheet PDF
Timing Type Synchronous
Number Of Words 512 kWords
Density 9 Mbit
Operating temperature -40 to 85 °C
Pin Count 165
Number Of Ports 1
Mounting Surface Mount
Address B 19 Bit
Number Of 18 Bit
Number Of 18 Bit
Maximum O 170@Flow-Through|225@Pipelined mA
Product description 15 x 13 x 0.94 mm
Maximum R 5@Flow-Through|2.5@Pipelined ns
Supplier FBGA
Typical O 2.5, 3.3 V
ECCN 3A991.B.2.B
Schedule B 8542320040
HTSN 8542320041
Country of origin Taiwan
Screening Level Industrial
Minimum O 2.3, 3 V
Maximum O 2.7, 3.6 V
Maximum C 200@Flow-Through|300@Pipelined MHz
Data Rate SDR
Architecture Flow-Through|Pipelined
Lead Finish Tin/Silver/Copper
Max Proce 260
Msl Level 3
SKU: GS88118CGD-300I