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SRAM Chip Sync Quad 3.3V 36M-Bit 1M x 36 3.4ns 165-Pin FBGA

The CY7C1440AV33 SRAM integrates 1,048,576 x 36, 2,097,152 x 18 and 524,288 x 72 SRAM cells with advanced synchronous peripheral circuitry and a two-bit counter for internal burst operation. All synchronous inputs are gated by registers controlled by a positive-edge-triggered Clock Input (CLK). The synchronous inputs include all addresses, all data inputs, address-pipelining Chip Enable (CE1), depth-expansion Chip Enables (CE2 and CE3[2]), Burst Control inputs (ADSC, ADSP, and ADV), Write Enables (BWX and BWE), and Global Write (GW).Asynchronous inputs include the Output Enable (OE) and the ZZ pin. Addresses and chip enables are registered at rising edge of clock when either Address Strobe Processor (ADSP) or Address Strobe Controller (ADSC) are active. Subsequent burst addresses can be internally generated as controlled by the Advance pin (ADV). Address, data inputs, and write controls are registered on-chip to initiate a self-timed Write cycle.This part supports Byte Write operations (see Pin Descriptions and Truth Table for further details). Write cycles can be one to two or four bytes wide as controlled by the byte write control inputs. GW when active LOW causes all bytes to be written. The CY7C1440AV33 operates from a +3.3V core power supply while all outputs may operate with either a +2.5 or +3.3V supply. All inputs and outputs are JEDEC-standard JESD8-5-compatible.
  • Supports bus operation up to 250 MHz
  • Available speed grades are 250, 200,167 MHz
  • Registered inputs and outputs for pipelined operation
  • 3.3V core power supply
  • 2.5V/3.3V I/O operation
  • Fast clock-to-output times
    • 2.6 ns (for 250-MHz device)
    • 3.2 ns (for 200-MHz device)
    • 3.4 ns (for 167-MHz device)
  • Provide high-performance 3-1-1-1 access rate
  • User-selectable burst counter supporting Intel® Pentium® interleaved or linear burst sequences
  • Separate processor and controller address strobes
  • Synchronous self-timed writes
  • Asynchronous output enable
  • Single Cycle Chip Deselect
  • Offered in JEDEC-standard 100-pin TQFP, 165-Ball fBGA and 209-Ball fBGA packages
  • Also available in lead-free packages
  • IEEE 1149.1 JTAG-Compatible Boundary Scan
  • “ZZ” Sleep Mode Option

Caractéristiques

Brand Rochester Electronics
Datasheet PDF
Timing Type Synchronous
Number Of Words 1 MWords
Density 36 Mb
Operating temperature 0 to 70 °C
Pin Count 165
Number Of Ports 4
Mounting Surface Mount
Address B 20 Bit
Number Of 36 Bit
Number Of 36 Bit
Maximum O 375 mA
Product description 17 x 15 x 0.89 mm
Maximum R 3.4 ns
Supplier FBGA
Typical O 3.3000 V
ECCN 3A991.B.2.A
Schedule B 8542320040
HTSN 8542320041
Country of origin United States
Screening Level Commercial
Minimum O 3.135 V
Maximum O 3.6 V
Maximum C 167 MHz
Data Rate SDR
Architecture Pipelined
Lead Finish Tin/Lead/Silver|Tin/Lead
Max Proce 235
Msl Level 3
SKU: CY7C1440AV33-167BZC