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Combo Mem 512Mx8 NAND Flash + 256Mx32 Mobile LPDDR3 1.8V 221-Pin WFBGA

Micron MCP products combine NAND Flash and Mobile LPDRAM devices in a single MCP. These products target mobile applications with low-power, high-performance, and minimal package-footprint design requirements. The NAND Flash and Mobile LPDRAM devices are also members of the Micron discrete memory products portfolio.The NAND Flash and Mobile LPDRAM devices are packaged with separate interfaces (no shared address, control, data, or power balls). This bus architecture supports an optimized interface to processors with separate NAND Flash and Mobile LPDRAM buses. The NAND Flash and Mobile LPDRAM devices have separate core power connections and share a common ground (that is, VSS is tied together on the two devices).The bus architecture of this device also supports separate NAND Flash and Mobile LPDRAM functionality without concern for device interaction.
  • Micron NAND Flash and LPDDR3 components
  • RoHS-compliant, “green” package
  • Separate NAND Flash and LPDDR3 interfaces
  • Space-saving multichip package (MCP)
  • Low-voltage operation (1.70–1.95V)
  • Wireless temperature range: –30°C to +85°C

Caractéristiques

Brand Micron
Organization 512Mx8 NAND Flash + 256Mx32 Mobile LPDDR3
Operating 1.8000 V
Screening Level Wireless
Operating temperature -30 to 85 °C
Schedule B 8542320050
HTSN 8542320051
Country of origin Taiwan
Product description 11.5 x 13 x 0.636 mm
Max Proce 260 °C
Supplier WFBGA
Lead Finish Tin|Silver|Copper
SKU: MT29UZ4B8DZZHGPB-107 W.84Z