Plataforma de comercio de materias primas

SRAM Chip Sync Single 1.8V 144M-Bit 16M x 9-Bit 0.45ns 165-Pin FBGA Tray

The GS81302T10E are built in compliance with the -II+ SRAM pin out standard for Common I/O synchronous SRAMs. They are 150,994,944-bit (144Mb) SRAMs. The GS81302T10E -II+ SRAMs are just one element in a family of low power, low voltage HSTL I/O SRAMs designed to operate at the speeds needed to implement economical high performance networking systems.
  • 2.0 Clock Latency
  • Simultaneous Read and Write ™ Interface
  • Common I/O bus
  • JEDEC-standard pinout and package
  • Double Data Rate interface
  • Byte Write controls sampled at data-in time
  • Burst of 2 Read and Write
  • On-Die Termination (ODT) on Data (D), Byte Write (BW), and Clock (K, K) inputs
  • 1.8 V +100/–100 mV core power supply
  • 1.5 V or 1.8 V HSTL Interface
  • Pipelined read operation with self-timed Late Write
  • Fully coherent read and write pipelines
  • ZQ pin for programmable output drive strength
  • Data Valid pin (QVLD) Support
  • IEEE 1149.1 JTAG-compliant Boundary Scan
  • 165-bump, 15 mm x 17 mm, 1 mm bump pitch BGA package
  • RoHS-compliant 165-bump BGA package available

Especificaciones

Brand GSI Technology
Datasheet PDF
Timing Type Synchronous
Number Of Words 16 MWords
Density 144 Mbit
Operating temperature 0 to 85 °C
Pin Count 165
Number Of Ports 1
Mounting Surface Mount
Address B 23 Bit
Number Of 9 Bit
Number Of 9 Bit
Maximum O 690 mA
Product description 17 x 15 x 1.04 mm
Maximum R 0.45 ns
Supplier FBGA
Typical O 1.8000 V
ECCN 3A991.B.2.B
Schedule B 8542320040
HTSN 8542320041
Country of origin Taiwan
Maximum C 300 MHz
Data Rate DDR
Architecture Pipelined
Lead Finish Tin/Lead
SKU: GS81302T10E-300