Passive/Active Combination Heatsink with Removable Fan for LGA2011-0 and FCLGA10 2U/3U/4U/5U Non-Intel Chassis
A Passive / Active Combination Heat Sink Solution that is intended for processors with a TDP up to 150W in a pedestal or 130W in 2U+ chassis with appropriate ducting.
Especificaciones
| Brand | Intel |
|---|---|
| Type Prod | Combo Heatsink |
| For Use With | LGA2011-0 and FCLGA10 2U/3U/4U/5U Non-Intel Chassis |
| Schedule B | 8473300002 |
| HTSN | 8473305100 |
| Country of origin | China |
| Product description | 91.5 x 91.5 x 64 |
| Thermal R | 0.0024 °C/W |
| Fin Style | Pin Array |
| Attachmen | Clip |
| Max Proce | 260 |
| Product length | 91.5 mm |
| Material | Aluminum |
SKU: BXSTS200C