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DSP Floating-Point 32-Bit/64-Bit 300MHz 2400MIPS 256-Pin BGA

The TMS320C672x is the next generation of Texas Instruments" C67x generation of high-performance 32-/64-bit floating-point digital signal processors. The TMS320C672x includes the TMS320C6727B, TMS320C6726B, TMS320C6722B, and TMS320C6720 devices.Enhanced C67x+ CPU. The C67x+ CPU is an enhanced version of the C67x CPU used on the C671x DSPs. It is compatible with the C67x CPU but offers significant improvements in speed, code density, and floating-point performance per clock cycle. At 350 MHz, the CPU is capable of a maximum performance of 2800 MIPS/2100 MFLOPS by executing up to eight instructions (six of which are floating-point instructions) in parallel each cycle. The CPU natively supports 32-bit fixed-point, 32-bit single-precision floating-point, and 64-bit double-precision floating-point arithmetic.Efficient Memory System. The memory controller maps the large on-chip 256K-byte RAM and 384K-byte ROM as unified program/data memory. Development is simplified since there is no fixed division between program and data memory size as on some other devices.The memory controller supports single-cycle data accesses from the C67x+ CPUto the RAM and ROM. Up to three parallel accesses to the internal RAM and ROMfrom three of the following four sources are supported:Two 64-bit data accesses from the C67x+ CPUOne 256-bit program fetch from the core and program cacheOne 32-bit data access from the peripheral system (either dMAX or UHPI)The large (32K-byte) program cache translates to a high hit rate for most applications. This prevents most program/data access conflicts to the on-chip memory. It also enables effective program execution from an off-chip memory such as an SDRAM.High-Performance Crossbar Switch. A high-performance crossbar switch acts as a central hub between the different bus masters (CPU, dMAX, UHPI) and different targets (peripherals and memory). The crossbar is partially connected; some connections are not supported (for example, UHPI-to-peripheral connections).Multiple transfers occur in parallel through the crossbar as long as there is no conflict between bus masters for a particular target. When a conflict does occur, the arbitration is a simple and deterministic fixed-priority scheme.The dMAX is given highest-priority since it is responsible for the most time-critical I/O transfers, followed next by the UHPI, and finally by the CPU.dMAX Dual Data Movement Accelerator. The dMAX is a module designed to perform Data Movement Acceleration. The Data Movement Accelerator (dMAX) controller handles user-programmed data transfers between the internal data memory controller and the device peripherals on the C672x DSPs. The dMAX allows movement of data to/from any addressable memory space including internalmemory, peripherals, and external memory.The dMAX controller includes features such as the capability to perform three-dimensional data transfers for advanced data sorting, and the capability to manage a section of the memory as a circular buffer/FIFO with delay-tap basedreading and writing of data. The dMAX controller is capable of concurrently processing two transfer requests (provided that they are to/from different source/destinations).External Memory Interface (EMIF) for Flexibility and Expansion. The external memory interface on the C672x supports a single bank of SDRAM and a single bank of asynchronous memory. The EMIF data width is 16 bits wide on the C6726B, C6722B, and C6720 and 32 bits wide on the C6727B.SDRAM support includes x16 and x32 SDRAM devices with 1, 2, or 4 banks.The C6726B, C6722B, and C6720 support SDRAM devices up to 128M bits.
  • C672x: 32-/64-Bit 350-MHz Floating-Point DSPs
  • Upgrades to C67x+ CPU From C67x™ DSP Generation:
    • 2X CPU Registers [64 General-Purpose]
    • New Audio-Specific Instructions
    • Compatible With the C67x CPU
  • Enhanced Memory System
    • 256K-Byte Unified Program/Data RAM
    • 384K-Byte Unified Program/Data ROM
    • Single-Cycle Data Access From CPU
    • Large Program Cache (32K Byte) Supports RAM, ROM, and External Memory
  • External Memory Interface (EMIF) Supports
    • 133-MHz SDRAM (16- or 32-Bit)
    • Asynchronous NOR Flash, SRAM (8-,16-, or 32-Bit)
    • NAND Flash (8- or 16-Bit)
  • Enhanced I/O System
    • High-Performance Crossbar Switch
    • Dedicated McASP DMA Bus
    • Deterministic I/O Performance
  • dMAX (Dual Data Movement Accelerator) Supports:
    • 16 Independent Channels
    • Concurrent Processing of Two Transfer Requests
    • 1-, 2-, and 3-Dimensional Memory-to-Memory and Memory-to-Peripheral Data Transfers
    • Circular Addressing Where the Size of a Circular Buffer (FIFO) is not Limited to 2n
    • Table-Based Multi-Tap Delay Read and Write Transfers From/To a Circular Buffer
  • Three Multichannel Audio Serial Ports
    • Transmit/Receive Clocks up to 50 MHz
    • Six Clock Zones and 16 Serial Data Pins
    • Supports TDM, I2S, and Similar Formats
    • DIT-Capable (McASP2)
  • Universal Host-Port Interface (UHPI)
    • 32-Bit-Wide Data Bus for High Bandwidth
    • Muxed and Non-Muxed Address and Data
  • Two 10-MHz SPI Ports With 3-, 4-, and 5-Pin Options
  • Two Inter-Integrated Circuit (I2C) Ports
  • Real-Time Interrupt Counter/Watchdog
  • Oscillator- and Software-Controlled PLL
  • Applications:
    • Professional Audio
      • Mixers
      • Effects Boxes
      • Audio Synthesis
      • Instrument/Amp Modeling
      • Audio Conferencing
      • Audio Broadcast
      • Audio Encoder
    • Emerging Audio Applications
    • Biometrics
    • Medical
    • Industrial
  • Commercial or Extended Temperature
  • 144-Pin, 0.5-mm, PowerPAD™ Thin Quad Flatpack (TQFP) [RFP Suffix]
  • 256-Terminal, 1.0-mm, 16x16 Array Plastic Ball Grid Array (PBGA) [GDH and ZDH Suffixes]
  • Especificaciones

    Brand Texas Instruments
    Program M 384 Kb
    Device In 300 MHz
    Data Bus Width 32, 64 Bit
    Numeric A Floating-Point
    Maximum Speed 300 MHz
    Instructi Advanced VLIW
    Supplier BGA
    Operating 1.2, 3.3 V
    Ram Size 256 KB
    Schedule B 8542310000
    HTSN 8542310001
    Country of origin Philippines
    Max Proce 260
    Product description 17 x 17 x 1.41 mm
    Msl Level 3
    Lead Finish Tin/Silver/Copper
    Device Mi 2400 MIPS
    SKU: TMS320C6727BZDH300