SRAM Chip Async Single 2.5V/3.3V 2M-Bit 128K x 16 45ns 44-Pin TSOP-II T/R

The CY62136FV30 is a high performance CMOS static RAM organized as 128K words by 16 bits. This device features advanced circuit design to provide ultra low active current. This is ideal for providing More Battery Life (MoBL) in portable applications such as cellular telephones. The device also has an automatic power down feature that significantly reduces power consumption by 90 percent when addresses are not toggling. Placing the device into standby mode reduces power consumption by more than 99 percent when deselected (CE\ HIGH). The input and output pins (I/O0 through I/O15) are placed in a high impedance state when the device is deselected (CE\ HIGH), the outputs are disabled (OE\ HIGH), both Byte High Enable and Byte Low Enable are disabled (BHE\, BLE\ HIGH) or during a write operation (CE\ LOW and WE\ LOW). Write to the device by taking Chip Enable (CE\) and Write Enable (WE\) inputs LOW. If Byte Low Enable (BLE\) is LOW, then data from I/O pins (I/O0 through I/O7) is written into the location specified on the address pins (A0 through A16). If Byte High Enable (BHE\) is LOW, then data from I/O pins (I/O8 through I/O15) is written into the location specified on the address pins (A0 through A16). Read from the device by taking Chip Enable (CE\) and Output Enable (OE\) LOW while forcing the Write Enable (WE\) HIGH. If Byte Low Enable (BLE\) is LOW, then data from the memory location specified by the address pins appears on I/O0 to I/O7. If Byte High Enable (BHE\) is LOW, then data from memory appears on I/O8 to I/O15.

• Very high speed: 45 ns
• Temperature ranges
  • Industrial: -40 °C to +85 °C
  • Automotive-A: -40 °C to +85 °C
  • Automotive-E: -40 °C to +125 °C
• Wide voltage range: 2.20 V to 3.60 V
• Pin compatible with CY62136V, CY62136CV30/CV33, andCY62136EV30
• Ultra low standby power
  • Typical standby current: 1 µA
  • Maximum standby current: 5 µA (Industrial)
• Ultra low active power
  • Typical active current: 1.6 mA at f = 1 MHz (45 ns speed)
• Easy memory expansion with CE and OE features
• Automatic power down when deselected
• Complementary metal oxide semiconductor (CMOS) for optimum speed and power
• Available in Pb-free 48-ball very fine-pitch ball grid array (VFBGA) and 44-pin thin small outline package (TSOP) II packages