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SRAM Chip Sync Single 1.8V 18M-Bit 512K x 36 0.45ns 165-Pin FBGA Tray

The CY7C1170KV18 is 1.8 V synchronous pipelined SRAMs equipped with DDR II+ architecture. The DDR II+ consists of an SRAM core with advanced synchronous peripheral circuitry. Addresses for read and write are latched on alternate rising edges of the input (K) clock.
  • 18-Mbit density (1 M × 18, 512 K × 36)
  • 550-MHz clock for high bandwidth
  • Two-word burst for reducing address bus frequency
  • Double data rate (DDR) interfaces (data transferred at 1100 MHz) at 550 MHz
  • Available in 2.5 clock cycle latency
  • Two input clocks for precise DDR timing
    • SRAM uses rising edges only
  • Echo clocks simplify data capture in high-speed systems
  • Data valid pin (QVLD) to indicate valid data on the output
  • Synchronous internally self-timed writes
  • DDR II+ operates with 2.5 cycle read latency when DOFF/ is asserted HIGH
  • Operates similar to DDR I device with one cycle read latency when DOFF/ is asserted LOW
  • Core VDD = 1.8 V ± 0.1 V; I/O VDDQ = 1.4 V to VDD
    • Supports both 1.5 V and 1.8 V I/O supply
  • HSTL inputs and variable drive HSTL output buffers
  • Available in 165-Ball FBGA package (13 × 15 × 1.4 mm)
  • Offered in both Pb-free and non Pb-free packages
  • JTAG 1149.1 compatible test access port
  • Phase-locked loop (PLL) for accurate data placement

Spezifikationen

Brand Rochester Electronics
Datasheet PDF
Timing Type Synchronous
Number Of Words 512 kWords
Density 18 Mb
Operating temperature 0 to 70 °C
Pin Count 165
Number Of Ports 1
Mounting Surface Mount
Address B 18 Bit
Number Of 36 Bit
Number Of 36 Bit
Maximum O 700 mA
Product description 15 x 13 x 0.89 mm
Maximum R 0.45 ns
Supplier FBGA
Typical O 1.8000 V
ECCN 3A991.B.2.A
Schedule B 8542320040
HTSN 8542320041
Country of origin United States
Screening Level Commercial
Minimum O 1.7 V
Maximum O 1.9 V
Maximum C 450 MHz
Data Rate DDR
Architecture Pipelined
Lead Finish Tin/Silver/Copper
Max Proce 260
Msl Level 3
SKU: CY7C1170KV18-450BZXC