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SRAM Chip Sync Quad 3.3V 9M-Bit 256K x 36 6.5ns 100-Pin TQFP

The CY7C1361C is a 3.3V, 256K x 36/512K x 18 Synchronous Flow-through SRAMs, respectively designed to interface with high-speed microprocessors with minimum glue logic. Maximum access delay from clock rise is 6.5 ns (133-MHz version). A 2-bit on-chip counter captures the first address in a burst and increments the address automatically for the rest of the burst access. All synchronous inputs are gated by registers controlled by a positive-edge-triggered Clock Input (CLK). The synchronous inputs include all addresses, all data inputs, address-pipelining Chip Enable (CE1), depth-expansion Chip Enables (CE2 and CE3[2]), Burst Control inputs (ADSC, ADSP, and ADV), Write Enables (BWx, and BWE), and Global Write (GW). Asynchronous inputs include the Output Enable (OE) and the ZZ pin. The CY7C1361C allows either interleaved or linear burst sequences, selected by the MODE input pin. A HIGH selects an interleaved burst sequence, while a LOW selects a linear burst sequence. Burst accesses can be initiated with the Processor Address Strobe (ADSP) or the cache Controller Address Strobe (ADSC) inputs. Address advancement is controlled by the Address Advancement (ADV) input. Addresses and chip enables are registered at rising edge of clock when either Address Strobe Processor (ADSP) or Address Strobe Controller (ADSC) are active. Subsequent burst addresses can be internally generated as controlled by the Advance pin (ADV). The CY7C1361C operates from a +3.3V core power supply while all outputs may operate with either a +2.5 or +3.3V supply. All inputs and outputs are JEDEC-standard JESD8-5-compatible.
  • Supports 100, 133-MHz bus operations
  • Supports 100-MHz bus operations (Automotive)
  • 256K × 36/512K × 18 common I/O
  • 3.3V -5% and +10% core power supply (VDD)
  • 2.5V or 3.3V I/O power supply (VDDQ)
  • Fast clock-to-output times
    • 6.5 ns (133-MHz version)
  • Provide high-performance 2-1-1-1 access rate
  • User-selectable burst counter supporting Intel® Pentium® interleaved or linear burst sequences
  • Separate processor and controller address strobes
  • Synchronous self-timed write
  • Asynchronous output enable
  • Available in lead-free 100-Pin TQFP package, lead-free and non lead-free 119-Ball BGA package and 165-Ball FBGA package
  • TQFP Available with 3-Chip Enable and 2-Chip Enable
  • IEEE 1149.1 JTAG-Compatible Boundary Scan
  • “ZZ” Sleep Mode option

Spezifikationen

Brand Rochester Electronics
Datasheet PDF
Timing Type Synchronous
Number Of Words 256 kWords
Density 9 Mb
Operating temperature 0 to 70 °C
Pin Count 100
Number Of Ports 4
Mounting Surface Mount
Address B 18 Bit
Number Of 36 Bit
Number Of 36 Bit
Maximum O 250 mA
Product description 20 x 14 x 1.4 mm
Maximum R 6.5 ns
Supplier TQFP
Typical O 3.3000 V
ECCN 3A991.B.2.A
Schedule B 8542320040
HTSN 8542320041
Country of origin United States
Screening Level Commercial
Minimum O 3.135 V
Maximum O 3.6 V
Maximum C 133 MHz
Data Rate SDR
Architecture Flow-Through
Lead Finish Matte Tin|Gold
Max Proce 260
Msl Level 3
SKU: CY7C1361C-133AJXC