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SRAM Chip Sync Quad 3.3V 18M-Bit 512K x 36 8.5ns 165-Pin FBGA Tray

The CY7C1381D is a 3.3V, 512K x 36 and 1 Mbit x 18 Synchronous Flow-through SRAMs, respectively designed to interface with high-speed microprocessors with minimum glue logic. Maximum access delay from clock rise is 6.5 ns (133-MHz version). A 2-bit on-chip counter captures the first address in a burst and increments the address automatically for the rest of the burst access. All synchronous inputs are gated by registers controlled by a positive-edge-triggered Clock Input (CLK). The synchronous inputs include all addresses, all data inputs, address-pipelining Chip Enable (CE1 ), depth-expansion Chip Enables (CE2 and CE3 [2]), Burst Control inputs (ADSC, ADSP, and ADV), Write Enables (BWx, and BWE), and Global Write (GW). Asynchronous inputs include the Output Enable (OE) and the ZZ pin. The CY7C1381D allows either interleaved or linear burst sequences, selected by the MODE input pin. A HIGH selects an interleaved burst sequence, while a LOW selects a linear burst sequence. Burst accesses can be initiated with the Processor Address Strobe (ADSP) or the cache Controller Address Strobe (ADSC) inputs. Address advancement is controlled by the Address Advancement (ADV) input. Addresses and chip enables are registered at rising edge of clock when either Address Strobe Processor (ADSP) or Address Strobe Controller (ADSC) are active. Subsequent burst addresses can be internally generated as controlled by the Advance pin (ADV). The CY7C1381D operates from a +3.3V core power supply while all outputs may operate with either a +2.5 or +3.3V supply. All inputs and outputs are JEDEC-standard JESD8-5-compatible.
  • Supports 133-MHz bus operations
  • 512K × 36/1M × 18 common I/O
  • 3.3V -5% and +10% core power supply (VDD)
  • 2.5V or 3.3V I/O supply (VDDQ)
  • Fast clock-to-output time
    • 6.5 ns (133-MHz version)
    • 8.5 ns (100-MHz version)
  • Provide high-performance 2-1-1-1 access rate
  • User-selectable burst counter supporting Intel? Pentium? interleaved or linear burst sequences
  • Separate processor and controller address strobes
  • Synchronous self-timed write
  • Asynchronous output enable
  • Offered in JEDEC-standard lead-free 100-pin TQFP,119-ball BGA and 165-ball fBGA packages
  • JTAG boundary scan for BGA and fBGA packages
  • “ZZ” Sleep Mode option

Spezifikationen

Brand Rochester Electronics
Datasheet PDF
Timing Type Synchronous
Number Of Words 512 kWords
Density 18 Mb
Operating temperature -40 to 85 °C
Pin Count 165
Number Of Ports 4
Mounting Surface Mount
Address B 19 Bit
Number Of 36 Bit
Number Of 36 Bit
Maximum O 175 mA
Product description 15 x 13 x 0.89 mm
Maximum R 8.5 ns
Supplier FBGA
Typical O 3.3000 V
ECCN 3A991.B.2.A
Schedule B 8542320040
HTSN 8542320041
Country of origin Taiwan
Screening Level Industrial
Minimum O 3.135 V
Maximum O 3.6 V
Maximum C 100 MHz
Data Rate SDR
Architecture Flow-Through
Lead Finish Tin/Silver/Copper
Max Proce 260
Msl Level 3
SKU: CY7C1381D-100BZXI