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SRAM Chip Sync Quad 1.8V/2.5V 9M-Bit 256K x 36 5.5ns/3ns 165-Pin FBGA Tray

SRAM Chip Sync Quad 1.8V/2.5V 9M-Bit 256K x 36 5.5ns/3ns 165-Pin FBGA Tray
  • FT pin for user-configurable flow through or pipeline operation
  • Single/Dual Cycle Deselect selectable
  • IEEE 1149.1 JTAG-compatible Boundary Scan
  • On-chip read parity checking; even or odd selectable
  • ZQ mode pin for user-selectable high/low output drive
  • 2.5 V or 3.3 V +10%/–10% core power supply
  • 2.5 V or 3.3 V I/O supply
  • LBO pin for Linear or Interleaved Burst mode
  • Internal input resistors on mode pins allow floating mode pins
  • Default to SCD x18/x36 Interleaved Pipeline mode
  • Byte Write (BW) and/or Global Write (GW) operation
  • Internal self-timed write cycle
  • Automatic power-down for portable applications
  • JEDEC-standard 119- and 165-bump BGA packages
  • 4th Generation, 13 mm x 15 mm, 165 FPBGA

Spezifikationen

Brand GSI Technology
Datasheet PDF
Timing Type Synchronous
Number Of Words 256 kWords
Density 9 Mbit
Operating temperature 0 to 70 °C
Pin Count 165
Number Of Ports 4
Mounting Surface Mount
Address B 18 Bit
Number Of 36 Bit
Number Of 36 Bit
Maximum O 140@Flow-Through|180@Pipelined mA
Product description 15 x 13 x 0.94 mm
Maximum R 5.5@Flow-Through|3@Pipelined ns
Supplier FBGA
Typical O 1.8, 2.5 V
ECCN 3A991.B.2.B
Schedule B 8542320040
HTSN 8542320041
Country of origin Taiwan
Screening Level Commercial
Minimum O 1.7, 2.3 V
Maximum O 2, 2.7 V
Maximum C 181.8@Flow-Through|250@Pipelined MHz
Data Rate SDR
Architecture Flow-Through|Pipelined
Lead Finish Tin/Lead
SKU: GS88236CD-250V