SRAM Chip Sync Dual 1.8V 72M-Bit 4M x 18 0.45ns 165-Pin FBGA Bulk
The GS8672T19B ECCRAMs are built in compliance with the -II+ SRAM pin out standard for Common I/O synchronous ECCRAMs. They are 75,497,472-bit (72Mb) ECCRAMs. The GS8672T19/37BE Sigma CIO ECCRAMs are just one element in a family of low power, low voltage HSTL I/O ECCRAMs designed to operate at the speeds needed to implement economical high performance networking systems.
- On-Chip ECC with virtually zero SER
- 2.0 Clock Latency
- Simultaneous Read and Write ™ Interface
- Common I/O bus
- JEDEC-standard pin out and package
- Double Data Rate interface
- Byte Write Capability
- Burst of 2 Read and Write
- 1.8 V +100/–100 mV core power supply
- 1.5 V HSTL Interface
- Pipelined read operation with self-timed Late Write
- Fully coherent read and write pipelines
- ZQ pin for programmable output drive strength
- IEEE 1149.1 JTAG-compliant Boundary Scan
- Pin-compatible with 18Mb, 36Mb and 144Mb devices
- 14 mm x 22 mm, 119 BGA
- RoHS-compliant 165-bump BGA package available
- 64MB or 72MB product family
Spezifikationen
| Brand | GSI Technology |
|---|---|
| Datasheet | |
| Timing Type | Synchronous |
| Number Of Words | 4 MWords |
| Density | 72 Mbit |
| Operating temperature | 0 to 70 °C |
| Pin Count | 165 |
| Number Of Ports | 2 |
| Mounting | Surface Mount |
| Address B | 22 Bit |
| Number Of | 18 Bit |
| Number Of | 18 Bit |
| Maximum O | 1170 mA |
| Product description | 15 x 17 x 1.04(Max) |
| Maximum R | 0.45 ns |
| Supplier | FBGA |
| Typical O | 1.8000 V |
| ECCN | 3A991.B.2.B |
| Schedule B | 8542320040 |
| HTSN | 8542320041 |
| Country of origin | Taiwan |
| Maximum C | 450 MHz |
| Data Rate | DDR |
| Architecture | Pipelined |
| Lead Finish | Tin|Silver|Copper |
| Max Proce | 260 |
| Msl Level | 3 |
SKU: GS8672T19BGE-450