Rohstoff-Handelsplattform

SRAM Chip Sync Dual 1.8V 72M-Bit 2M x 36 0.45ns 165-Pin FBGA

The GS8672T37BGE ECCRAMs are built in compliance with the -II+ SRAM pin out standard for Common I/O synchronous ECCRAMs. They are 75,497,472-bit (72Mb) ECCRAMs. The GS8672T37BGE ECCRAMs are just one element in a family of low power, low voltage HSTL I/O ECCRAMs designed to operate at the speeds needed to implement economical high performance networking systems.
  • On-Chip ECC with virtually zero SER
  • 2.0 Clock Latency
  • Simultaneous Read and Write ™ Interface
  • Common I/O bus
  • JEDEC-standard pin out and package
  • Double Data Rate interface
  • Byte Write Capability
  • Burst of 2 Read and Write
  • 1.8 V +100/–100 mV core power supply
  • 1.5 V HSTL Interface
  • Pipelined read operation with self-timed Late Write
  • Fully coherent read and write pipelines
  • ZQ pin for programmable output drive strength
  • IEEE 1149.1 JTAG-compliant Boundary Scan
  • Pin-compatible with 18Mb, 36Mb and 144Mb devices
  • Green 15 mm x 17 mm, 165 FPBGA
  • RoHS-compliant 165-bump BGA package available
  • 64MB or 72MB product family

Spezifikationen

Brand GSI Technology
Datasheet PDF
Timing Type Synchronous
Number Of Words 2 MWords
Density 72 Mbit
Operating temperature -40 to 100 °C
Pin Count 165
Number Of Ports 2
Mounting Surface Mount
Address B 21 Bit
Number Of 36 Bit
Number Of 36 Bit
Maximum O 1390 mA
Product description 17 x 15 x 1.04 mm
Maximum R 0.45 ns
Supplier FBGA
Typical O 1.8000 V
ECCN 3A991.B.2.B
Schedule B 8542320040
HTSN 8542320041
Country of origin Taiwan
Screening Level Industrial
Minimum O 1.7 V
Maximum O 1.9 V
Maximum C 375 MHz
Data Rate DDR
Architecture Pipelined
SKU: GS8672T37BGE-375I