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Registered Bus Exchanger 1-Element 56-Pin SSOP T/R

This 12-bit to 24-bit registered bus exchanger is designed for 1.65-V to 3.6-V VCC operation. The SN74ALVCH16270 is used in applications in which data must be transferred from a narrow high-speed bus to a wide lower-frequency bus. The device provides synchronous data exchange between the two ports. Data is stored in the internal registers on the low-to-high transition of the clock (CLK) input when the appropriate CLKEN\ inputs are low. The select (SEL)\ line selects 1B or 2B data for the A outputs. For data transfer in the A-to-B direction, a two-stage pipeline is provided in the A-to-1B path, with a single storage register in the A-to-2B path. Proper control of the CLKENA\ inputs allows two sequential 12-bit words to be presented synchronously as a 24-bit word on the B port. Data flow is controlled by the active-low output enables (OEA\, OEB\). The control terminals are registered to synchronize the bus-direction changes with CLK.To ensure the high-impedance state during power up or power down, a clock pulse should be applied as soon as possible, and OE should be tied to VCC through a pullup resistor; the minimum value of the resistor is determined by the current-sinking capability of the driver. Due to OE being routed through a register, the active state of the outputs cannot be determined prior to the arrival of the first clock pulse. Active bus-hold circuitry is provided to hold unused or floating data inputs at a valid logic level. The SN74ALVCH16270 is characterized for operation from –40°C to 85°C.
  • Member of the Texas Instruments Widebus™ Family
  • EPIC™ (Enhanced-Performance Implanted CMOS) Submicron Process
  • Bus Hold on Data Inputs Eliminates the Need for External Pullup/Pulldown Resistors
  • ESD Protection Exceeds 2000 V Per MIL-STD-883, Method 3015; Exceeds 200 V Using Machine Model (C = 200 pF, R = 0)
  • Latch-Up Performance Exceeds 250 mA Per JESD 17
  • Package Options Include Plastic Shrink Small-Outline (DL) and Thin Shrink Small-Outline (DGG) Packages
  • Spezifikationen

    Brand Texas Instruments
    Datasheet PDF
    Pin Count 56
    Lead Finish Gold
    Maximum F 0.15(Min)@2.5V to 3.3V GHz
    Power Sup Single
    Maximum O 3.6 V
    Mounting Surface Mount
    Operating temperature -40 to 85 °C
    Supplier SSOP
    Maximum Q 40 uA
    Msl Level 1
    Number Of 24
    Configuration 12 x 2:1
    Number Of 12
    Maximum L 24 mA
    Max Proce 260
    Minimum O 1.65 V
    Product description 18.41 x 7.49 x 2.59 mm
    Output Type 3-State
    ECCN EAR99
    Schedule B 8542390000
    HTSN 8542390001
    Country of origin United States
    SKU: SN74ALVCH16270DLR