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SRAM Chip Sync Quad 3.3V 8M-Bit 256K x 32 3.5ns 100-Pin TQFP

The CY7C1368C SRAM integrates 256K x 32 SRAM cells with advanced synchronous peripheral circuitry and a two-bit counter for internal burst operation. All synchronous inputs are gated by registers controlled by a positive-edge-triggered Clock Input (CLK). The synchronous inputs include all addresses, all data inputs, address-pipelining Chip Enable (CE1), depth-expansion Chip Enables (CE2 and CE3[2]), Burst Control inputs (ADSC, ADSP, and ADV), Write Enables (BWA, BWB, BWC, BWD, and BWE), and Global Write (GW). Asynchronous inputs include the Output Enable (OE) and theZZ pin. Addresses and chip enables are registered at rising edge of clock when either Address Strobe Processor (ADSP) or Address Strobe Controller (ADSC) are active. Subsequent burst addresses can be internally generated as controlled by the Advance pin (ADV). Address, data inputs, and write controls are registered on-chip to initiate a self-timed Write cycle. This part supports Byte Write operations (see Pin Descriptions and Truth Table for further details). Write cycles can be one to four bytes wide as controlled by the byte write control inputs. GW active LOW causes all bytes to be written. This device incorporates an additional pipelined enable register which delays turning off the output buffers an additional cycle when a deselect is executed.This feature allows depth expansion without penal izing system performance. The CY7C1368C operates from a +3.3V core power supply while all outputs may operate with either a +2.5 or +3.3V supply. All inputs and outputs are JEDEC-standard JESD8-5-compatible.
  • Registered inputs and outputs for pipelined operation
  • Optimal for performance (Double-Cycle deselect)
    • Depth expansion without wait state
  • 256K × 32-bit common I/O architecture
  • 3.3V core power supply (VDD)
  • 2.5V/3.3V I/O power supply (VDDQ)
  • Fast clock-to-output times
    • 2.8 ns (for 250-MHz device)
  • Provide high-performance 3-1-1-1 access rate
  • User-selectable burst counter supporting Intel® Pentium® interleaved or linear burst sequences
  • Multiple chip enables for depth expansion: Three chip enables for A package version and Two chip enables for AJ package version
  • Separate processor and controller address strobes
  • Synchronous self-timed writes
  • Asynchronous Output Enable
  • Available in JEDEC-standard lead-free 100-Pin TQFP package
  • “ZZ” Sleep Mode option

规格参数

Brand Rochester Electronics
Datasheet PDF
Timing Type Synchronous
Number Of Words 256 kWords
Density 8 Mb
Operating temperature 0 to 70 °C
Pin Count 100
Number Of Ports 4
Mounting Surface Mount
Address B 18 Bit
Number Of 32 Bit
Number Of 32 Bit
Maximum O 180 mA
Product description 20 x 14 x 1.4 mm
Maximum R 3.5 ns
Supplier TQFP
Typical O 3.3000 V
ECCN 3A991.B.2.A
Schedule B 8542320040
HTSN 8542320041
Country of origin United States
Screening Level Commercial
Minimum O 3.135 V
Maximum O 3.6 V
Maximum C 166 MHz
Data Rate SDR
Architecture Pipelined
Lead Finish Matte Tin|Gold
Max Proce 260
Msl Level 3
SKU: CY7C1368C-166AXC