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SRAM Chip Sync Dual 1.8V 18M-Bit 1M x 18 3.3ns 256-Pin FBGA Tray

The FullFlex dual port SRAM families consist of 2-Mbit, 9-Mbit, 18-Mbit, and 36-Mbit synchronous, true dual port static RAMs that are high speed, low power 1.8 V or 1.5 V CMOS. Two ports are provided, enabling simultaneous access to the array. Simultaneous access to a location triggers deterministic access control. For FullFlex72 these ports operate independently with 72-bit bus widths and each port is independently configured for two pipelined stages. Each port is also configured to operate in pipelined or flow through mode.
  • True dual port memory enables simultaneous access the shared array from each port
  • Synchronous pipelined operation with single data rate (SDR) operation on each port
    • SDR interface at 200 MHz
    • Up to 28.8 Gb/s bandwidth (200 MHz × 72-bit × 2 ports)
  • Selectable pipelined or flow-through mode
  • 1.5 V or 1.8 V core power supply
  • Commercial and Industrial temperature
  • IEEE 1149.1 JTAG boundary scan
  • Available in 484-ball PBGA (× 72) and 256-ball FBGA (× 36 and × 18) packages
  • FullFlex18 family
    • 18-Mbit: 1 M × 18 (CYD18S18V18)
  • Built in deterministic access control to manage address collisions
    • Deterministic flag output upon collision detection
    • Collision detection on back-to-back clock cycles
    • First busy address readback
  • Advanced features for improved high speed data transfer and flexibility
    • Variable impedance matching (VIM)
    • Echo clocks
    • Selectable LVTTL (3.3 V), Extended HSTL (1.4 V to 1.9 V), 1.8 V LVCMOS, or 2.5 V LVCMOS IO on each port
    • Burst counters for sequential memory access
    • Mailbox with interrupt flags for message passing
    • Dual chip enables for easy depth expansion

规格参数

Brand Rochester Electronics
Datasheet PDF
Timing Type Synchronous
Number Of Words 1 MWords
Density 18 Mb
Operating temperature 0 to 70 °C
Pin Count 256
Number Of Ports 2
Mounting Surface Mount
Address B 20 Bit
Number Of 18 Bit
Number Of 18 Bit
Maximum O 770 mA
Product description 17 x 17 x 1.25 mm
Maximum R 3.3 ns
Supplier FBGA
Typical O 1.8000 V
ECCN 3A991.B.2.B
Schedule B 8542320040
HTSN 8542320041
Country of origin United States
Screening Level Commercial
Minimum O 1.7 V
Maximum O 1.9 V
Maximum C 200 MHz
Data Rate SDR
Architecture Flow-Through|Pipelined
Lead Finish Tin/Silver/Copper
Max Proce 260
Msl Level 3
SKU: CYD18S18V18-200BBAXC