MCU 32-bit TC11xx TriCore RISC 4096KB Flash 1.5V/2.5V/3.3V/5V 416-Pin BGA, SAK-TC1197-512F180E AC, Infineon

The TC1197 combines three powerful technologies within one silicon die, achieving new levels of power, speed, and economy for embedded applications: Reduced Instruction Set Computing (RISC) processor architectureDigital Signal Processing (DSP) operations and addressing modesOn-chip memories and peripherals DSP operations and addressing modes provide the computational power necessary to efficiently analyze complex real-world signals. The RISC load/store architecture provides high computational bandwidth with low system cost. On-chip memory and peripherals are designed to support even the most demanding high-bandwidth real-time embedded control-systems tasks. The TC1197 is a high-performance microcontroller with TriCore CPU, program and data memories, buses, bus arbitration, an interrupt controller, a peripheral control processor and a DMA controller and several on-chip peripherals. The TC1197 is designed to meet the needs of the most demanding embedded control systems applications where the competing issues of price/performance, real-time responsiveness, computational power, data bandwidth, and power consumption are key design elements. The TC1197 offers several versatile on-chip peripheral units such as serial controllers, timer units, and Analog-to-Digital converters. Within the TC1197, all these peripheral units are connected to the TriCore CPU/system via the Flexible Peripheral Interconnect (FPI) Bus and the Local Memory Bus (LMB). Several I/O lines on the TC1197 ports are reserved for these peripheral units to communicate with the external world.

  • High-performance 32-bit super-scalar TriCore V1.3.1 CPU with 4-stage pipeline
    • Superior real-time performance
    • Strong bit handling
    • Fully integrated DSP capabilities
    • Single precision Floating Point Unit (FPU)
    • 180 MHz operation at full temperature range
  • 32-bit Peripheral Control Processor with single cycle instruction (PCP2)
    • 16 Kbyte Parameter Memory (PRAM)
    • 32 Kbyte Code Memory (CMEM)
    • 180 MHz operation at full temperature range
  • Multiple on-chip memories
    • 4 or 2 Mbyte Program Flash Memory (PFLASH) with ECC
    • 64 Kbyte Data Flash Memory (DFLASH) usable for EEPROM emulation
    • 128 Kbyte Data Memory (LDRAM)
    • 40 Kbyte Code Scratchpad Memory (SPRAM)
    • Instruction Cache: up to 16 Kbyte (ICACHE, configurable)
    • Data Cache: up to 4 Kbyte (DCACHE, configurable)
    • 8 Kbyte Overlay Memory (OVRAM)
    • 16 Kbyte BootROM (BROM)
  • 16-Channel DMA Controller
  • 32-bit External Bus Interface Unit (EBU) with
    • 32-bit demultiplexed / 16-bit multiplexed external bus interface (3.3V, 2.5V)
    • Support for Burst Flash memory devices
    • Scalable external bus timing up to 75 MHz
  • Sophisticated interrupt system with 2 × 255 hardware priority arbitration levels serviced by CPU or PCP2
  • High performing on-chip bus structure
    • 64-bit Local Memory Buses between CPU, EBU, Flash and Data Memory
    • 32-bit System Peripheral Bus (SPB) for on-chip peripheral and functional units
    • One bus bridges (LFI Bridge)
  • Versatile On-chip Peripheral Units
    • Two Asynchronous/Synchronous Serial Channels (ASC) with baud rate generator, parity, framing and overrun error detection
    • Two High-Speed Synchronous Serial Channels (SSC) with programmable data length and shift direction
    • Two serial Micro Second Bus interface (MSC) for serial port expansion to external power devices
    • Two High-Speed Micro Link interface (MLI) for serial inter-processor communication
    • One MultiCAN Module with 4 CAN nodes and 128 free assignable message objects for high efficiency data handling via FIFO buffering and gateway data transfer
    • Two General Purpose Timer Array Modules (GPTA) with additional Local Timer Cell Array (LTCA2) providing a powerful set of digital signal filtering and timer functionality to realize autonomous and complex Input/Output management
  • 44 analog input lines for ADC
    • 3 independent kernels (ADC0, ADC1, ADC2)
    • Analog supply voltage range from 3.3 V to 5 V (single supply)
    • Performance for 12 bit resolution (@fADCI = 10 MHz)
  • 4 different FADC input channels
    • channels with impedance control and overlaid with ADC1 inputs
    • Extreme fast conversion, 21 cycles of fFADC clock (262.5 ns @ fFADC = 80 MHz)
    • 10-bit A/D conversion (higher resolution can be achieved by averaging of consecutive conversions in digital data reduction filter)
  • 221 digital general purpose I/O lines1) (GPIO), 4 input lines
  • Digital I/O ports with 3.3 V capability
  • On-chip debug support for OCDS Level 1 (CPU, PCP, DMA, On Chip Bus)
  • Dedicated Emulation Device chip available (TC1797ED)
    • multi-core debugging, real time tracing, and calibration
    • four/five wire JTAG (IEEE 1149.1) or two wire DAP (Device Access Port) interface
  • Power Management System
  • Clock Generation Unit with PLL
  • Core supply voltage of 1.5 V
  • I/O voltage of 3.3 V
  • Temperature range: -40° to +125°C
  • Package variants: PG-BGA-416-10

Характеристики

Program_memory_size

4096 KB

Msl_level

3

Number_of_timers

3

On_chip_adc

3(44-chx12-bit), 4-chx10-bit

Operating_supply_voltage

1.5, 2.5, 3.3, 5 V

Operating_temperature

-40 to 125 °C

Pin_count

416

Product_dimensions

27 x 27 x 1.73 mm

Program_memory_type

Flash

Mounting

Surface Mount

Ram_size

156 KB

Schedule_b

8542390000

Specifications

https://4donline.ihs.com/images/VipMasterIC/IC/INFN/INFNS14223/INFNS14223-1.pdf?hkey=52A5661711E402568146F3353EA87419

Supplier_package

BGA

Watchdog

1

Number_of_programmable_i_os

221

Бренд

Min_operating_supply_voltage

1.42, 2.375, 3.13, 4.75 V

Country_of_origin

United States

Data_bus_width

32 Bit

Data_memory_size

64 Kb

Device_core

TriCore

Eccn

EAR99

Htsn

8542310001

Max_speed

180 MHz

Instruction_set_architecture

RISC

Тип интерфейса

ASC/IIC/MLI/SSC

Lead_finish

Tin/Silver/Copper

Max_expanded_memory_size

4 GB

Max_operating_supply_voltage

1.58, 2.625, 3.47, 5.25 V

Max_power_dissipation

1800 mW

Max_processing_temp

250 °C

SKU: SAK-TC1197-512F180E AC

Description

The TC1197 combines three powerful technologies within one silicon die, achieving new levels of power, speed, and economy for embedded applications: Reduced Instruction Set Computing (RISC) processor architectureDigital Signal Processing (DSP) operations and addressing modesOn-chip memories and peripherals DSP operations and addressing modes provide the computational power necessary to efficiently analyze complex real-world signals. The RISC load/store architecture provides high computational bandwidth with low system cost. On-chip memory and peripherals are designed to support even the most demanding high-bandwidth real-time embedded control-systems tasks. The TC1197 is a high-performance microcontroller with TriCore CPU, program and data memories, buses, bus arbitration, an interrupt controller, a peripheral control processor and a DMA controller and several on-chip peripherals. The TC1197 is designed to meet the needs of the most demanding embedded control systems applications where the competing issues of price/performance, real-time responsiveness, computational power, data bandwidth, and power consumption are key design elements. The TC1197 offers several versatile on-chip peripheral units such as serial controllers, timer units, and Analog-to-Digital converters. Within the TC1197, all these peripheral units are connected to the TriCore CPU/system via the Flexible Peripheral Interconnect (FPI) Bus and the Local Memory Bus (LMB). Several I/O lines on the TC1197 ports are reserved for these peripheral units to communicate with the external world.

  • High-performance 32-bit super-scalar TriCore V1.3.1 CPU with 4-stage pipeline
    • Superior real-time performance
    • Strong bit handling
    • Fully integrated DSP capabilities
    • Single precision Floating Point Unit (FPU)
    • 180 MHz operation at full temperature range
  • 32-bit Peripheral Control Processor with single cycle instruction (PCP2)
    • 16 Kbyte Parameter Memory (PRAM)
    • 32 Kbyte Code Memory (CMEM)
    • 180 MHz operation at full temperature range
  • Multiple on-chip memories
    • 4 or 2 Mbyte Program Flash Memory (PFLASH) with ECC
    • 64 Kbyte Data Flash Memory (DFLASH) usable for EEPROM emulation
    • 128 Kbyte Data Memory (LDRAM)
    • 40 Kbyte Code Scratchpad Memory (SPRAM)
    • Instruction Cache: up to 16 Kbyte (ICACHE, configurable)
    • Data Cache: up to 4 Kbyte (DCACHE, configurable)
    • 8 Kbyte Overlay Memory (OVRAM)
    • 16 Kbyte BootROM (BROM)
  • 16-Channel DMA Controller
  • 32-bit External Bus Interface Unit (EBU) with
    • 32-bit demultiplexed / 16-bit multiplexed external bus interface (3.3V, 2.5V)
    • Support for Burst Flash memory devices
    • Scalable external bus timing up to 75 MHz
  • Sophisticated interrupt system with 2 × 255 hardware priority arbitration levels serviced by CPU or PCP2
  • High performing on-chip bus structure
    • 64-bit Local Memory Buses between CPU, EBU, Flash and Data Memory
    • 32-bit System Peripheral Bus (SPB) for on-chip peripheral and functional units
    • One bus bridges (LFI Bridge)
  • Versatile On-chip Peripheral Units
    • Two Asynchronous/Synchronous Serial Channels (ASC) with baud rate generator, parity, framing and overrun error detection
    • Two High-Speed Synchronous Serial Channels (SSC) with programmable data length and shift direction
    • Two serial Micro Second Bus interface (MSC) for serial port expansion to external power devices
    • Two High-Speed Micro Link interface (MLI) for serial inter-processor communication
    • One MultiCAN Module with 4 CAN nodes and 128 free assignable message objects for high efficiency data handling via FIFO buffering and gateway data transfer
    • Two General Purpose Timer Array Modules (GPTA) with additional Local Timer Cell Array (LTCA2) providing a powerful set of digital signal filtering and timer functionality to realize autonomous and complex Input/Output management
  • 44 analog input lines for ADC
    • 3 independent kernels (ADC0, ADC1, ADC2)
    • Analog supply voltage range from 3.3 V to 5 V (single supply)
    • Performance for 12 bit resolution (@fADCI = 10 MHz)
  • 4 different FADC input channels
    • channels with impedance control and overlaid with ADC1 inputs
    • Extreme fast conversion, 21 cycles of fFADC clock (262.5 ns @ fFADC = 80 MHz)
    • 10-bit A/D conversion (higher resolution can be achieved by averaging of consecutive conversions in digital data reduction filter)
  • 221 digital general purpose I/O lines1) (GPIO), 4 input lines
  • Digital I/O ports with 3.3 V capability
  • On-chip debug support for OCDS Level 1 (CPU, PCP, DMA, On Chip Bus)
  • Dedicated Emulation Device chip available (TC1797ED)
    • multi-core debugging, real time tracing, and calibration
    • four/five wire JTAG (IEEE 1149.1) or two wire DAP (Device Access Port) interface
  • Power Management System
  • Clock Generation Unit with PLL
  • Core supply voltage of 1.5 V
  • I/O voltage of 3.3 V
  • Temperature range: -40° to +125°C
  • Package variants: PG-BGA-416-10

Additional information

Program_memory_size

4096 KB

Msl_level

3

Number_of_timers

3

On_chip_adc

3(44-chx12-bit), 4-chx10-bit

Operating_supply_voltage

1.5, 2.5, 3.3, 5 V

Operating_temperature

-40 to 125 °C

Pin_count

416

Product_dimensions

27 x 27 x 1.73 mm

Program_memory_type

Flash

Mounting

Surface Mount

Ram_size

156 KB

Schedule_b

8542390000

Specifications

https://4donline.ihs.com/images/VipMasterIC/IC/INFN/INFNS14223/INFNS14223-1.pdf?hkey=52A5661711E402568146F3353EA87419

Supplier_package

BGA

Watchdog

1

Number_of_programmable_i_os

221

Бренд

Min_operating_supply_voltage

1.42, 2.375, 3.13, 4.75 V

Country_of_origin

United States

Data_bus_width

32 Bit

Data_memory_size

64 Kb

Device_core

TriCore

Eccn

EAR99

Htsn

8542310001

Max_speed

180 MHz

Instruction_set_architecture

RISC

Тип интерфейса

ASC/IIC/MLI/SSC

Lead_finish

Tin/Silver/Copper

Max_expanded_memory_size

4 GB

Max_operating_supply_voltage

1.58, 2.625, 3.47, 5.25 V

Max_power_dissipation

1800 mW

Max_processing_temp

250 °C