MCU 32-Bit RX210 RX RISC 256KB Flash 3.3V/5V 48-Pin LFQFP Tray

RX210 Flash MCUs bring new levels of capability and performance to ultra-low-power, low-voltage embedded-system applications. Based on the fast 32-bit RX CPU core, RX210 chips are the first members of the RX200 series of middle-range products.

• 32-bit RX CPU Core
• Max. operating frequency: 50 MHz Capable of 78 DMIPS in operation at 50 MHz
• Accumulator handles 64-bit results (for a single instruction) from 32- x 32-bit operations
• Multiplication and division unit handles 32- x 32-bit operations (multiplication instructions take one CPU clock cycle)
• Fast interrupt
• CISC Harvard architecture with 5-stage pipeline
• Variable-length instructions, ultra-compact code
• On-chip debugging circuit
• Operation from a single 1.62- to 5.5-V supply
• 1.62-V operation available (at up to 20 MHz)
• Deep software standby mode with RTC remaining usable
• Four low-power modes
• 50-MHz operation, 20-ns read cycle
• No wait states for reading at full CPU speed
• 128- to 512-Kbyte capacities
• User code programmable via the SCI
• Programmable at 1.62 V
• Eight Kbytes
• Erasing and programming impose no load on the CPU.
• 20- to 64-Kbyte size capacities
• DMACA: Incorporates four channels
• DTC: Four transfer modes
• Module operation can be initiated by event signals without going through interrupts
• Modules can operate while the CPU is sleeping.
• Nine types of reset, including the power-on reset (POR)
• Low voltage detection (LVD) with voltage settings
• Frequency of external clock: Up to 20 MHz
• Frequency of the oscillator for sub-clock generation: 32.768 kHz
• PLL circuit input: 4 to 12.5 MHz
• On-chip low- and high-speed oscillators, dedicated on chip low-speed oscillator for the IWDT
• Generation of a dedicated 32.768-kHz clock for the RTC
• Clock frequency accuracy measurement circuit (CAC)
• Adjustment functions (30 seconds, leap year, and error)
• Time capture function
• Time capture on event-signal input through external pins
• RTC capable of initiating return from deep software standby mode
• 125-kHz on-chip low-speed oscillator produces a dedicated clock signal to drive IWDT operation
• Adjustment functions (30 seconds, leap year, and error)
• SCI with many useful functions (up to seven interfaces)
• Asynchronous mode, clock synchronous mode, smart card interface
• I2C bus interface: Transfer at up to 1 Mbps, capable of SMBus operation (1 interface)
• RSPI
• Four CS areas (4 x 16 Mbytes)
• 8- or 16-bit bus space is selectable per area
• 16-bit MTU2: input capture, output capture, complementary PWM output, phase counting mode (6 channels)
• 8-bit TMR (4 channels)
• 16-bit compare-match timers (4 channels)
• Capable of conversion within 1 µs
• Sample-and-hold circuits (for three channels)
• Three-channel synchronized sampling available
• Self-diagnostic function and analog input disconnection detection assistance function
• 5-V tolerant, open drain, input pull-up, switching of driving ability
• ROM, RAM, and E2 Data Flash capacity 256 Kbytes/32 Kbytes/8 Kbytes
• Chip version B
• Operating Temp. Range -40 °C to +85°C