, LPC2212FBD144/01,551, NXP

Характеристики

Program_memory_type

Flash

Supplier_package

LQFP

Screening_level

Industrial

Schedule_b

8542310000

Ram_size

16 Kb

Program_memory_size

128 KB

Product_dimensions

20.1 x 20.1 x 1.45 mm

Pin_count

144

Operating_temperature

-40 to 85 °C

Operating_supply_voltage

1.8, 3.3 V

Eccn

EAR99

Instruction_set_architecture

RISC

Htsn

8542310001

Тип интерфейса

I2C/SPI/SSP/UART

Device_core

ARM7TDMI-S

Data_bus_width

16, 32 Bit

Country_of_origin

Taiwan

Бренд

On_chip_adc

8-chx10-bit

Min_operating_supply_voltage

1.65, 2.5, 3 V

Number_of_timers

2

Number_of_programmable_i_os

112

Msl_level

2

Mounting

Surface Mount

Max_speed

60 MHz

Max_processing_temp

260 °C

Max_power_dissipation

1500 mW

Max_operating_supply_voltage

1.95, 3.6 V

Lead_finish

Tin

Артикул: LPC2212FBD144/01,551

Описание

Детали

Program_memory_type

Flash

Supplier_package

LQFP

Screening_level

Industrial

Schedule_b

8542310000

Ram_size

16 Kb

Program_memory_size

128 KB

Product_dimensions

20.1 x 20.1 x 1.45 mm

Pin_count

144

Operating_temperature

-40 to 85 °C

Operating_supply_voltage

1.8, 3.3 V

Eccn

EAR99

Instruction_set_architecture

RISC

Htsn

8542310001

Тип интерфейса

I2C/SPI/SSP/UART

Device_core

ARM7TDMI-S

Data_bus_width

16, 32 Bit

Country_of_origin

Taiwan

Бренд

On_chip_adc

8-chx10-bit

Min_operating_supply_voltage

1.65, 2.5, 3 V

Number_of_timers

2

Number_of_programmable_i_os

112

Msl_level

2

Mounting

Surface Mount

Max_speed

60 MHz

Max_processing_temp

260 °C

Max_power_dissipation

1500 mW

Max_operating_supply_voltage

1.95, 3.6 V

Lead_finish

Tin