, LPC11U24FHN33/401,, NXP

Product_dimensions	7 x 7 x 0.83 mm
Device_core	ARM Cortex M0
Max_expanded_memory_size	16 KB
Max_power_dissipation	1.5 W
Max_processing_temp	260 °C
Mounting	Surface Mount
Msl_level	3
Max_speed	50 MHz
Number_of_programmable_i_os	26
Тип интерфейса	Serial I2C, SPI, SSP, USART, USB
Instruction_set_architecture	RISC
Бренд	NXP
Country_of_origin	Taiwan
Data_bus_width	32 Bit
Data_memory_size	4 Kb
Eccn	EAR99
Screening_level	Industrial
Htsn	8542310001
Analog_comparators	1
Number_of_timers	4
On_chip_adc	8-chx10-bit
Watchdog	1
Operating_supply_voltage	1.8 to 3.6 V
Operating_temperature	-40 to 85 °C
Supplier_package	HVQFN
Pin_count	33
Program_memory_size	32 Kb
Program_memory_type	Flash
Ram_size	10 KB
Schedule_b	8542310000
Lead_finish	Gold Over Nickel Palladium

Артикул: LPC11U24FHN33/401,

Описание

Product_dimensions	7 x 7 x 0.83 mm
Device_core	ARM Cortex M0
Max_expanded_memory_size	16 KB
Max_power_dissipation	1.5 W
Max_processing_temp	260 °C
Mounting	Surface Mount
Msl_level	3
Max_speed	50 MHz
Number_of_programmable_i_os	26
Тип интерфейса	Serial I2C, SPI, SSP, USART, USB
Instruction_set_architecture	RISC
Бренд	NXP
Country_of_origin	Taiwan
Data_bus_width	32 Bit
Data_memory_size	4 Kb
Eccn	EAR99
Screening_level	Industrial
Htsn	8542310001
Analog_comparators	1
Number_of_timers	4
On_chip_adc	8-chx10-bit
Watchdog	1
Operating_supply_voltage	1.8 to 3.6 V
Operating_temperature	-40 to 85 °C
Supplier_package	HVQFN
Pin_count	33
Program_memory_size	32 Kb
Program_memory_type	Flash
Ram_size	10 KB
Schedule_b	8542310000
Lead_finish	Gold Over Nickel Palladium