Описание
The MEG-Array Mezzanine Connector system provides the high density and high speed benefits of a large array supported by the reliability and low costs of standard surface mount PCB assembly.1.27mm x 1.27mm array of discrete circuit contacts allows flexible ground distribution to optimize high speed signal integrity at speeds exceeding 10 Gb/s. MEG-Array is offered in a variety of PCB mezzanine stack heights.
- High density, high speed, discrete contact, array connector
- Flexible ground distribution optimizes high speed signal integrity
- 10 Gb/s differential pair performance with under 1% cross-talk
- 28 Gb/s high speed performance documented for 4mm and 6mm stack height
- Online s-parameter files and signal integrity performance reports improve design accuracy and time-to-market
- 1.27mm x 1.27mm grid provides 71 contacts per cm2 density to save space
- Wide range of sizes and PCB stack heights increase mechanical design flexibility
- 6 PCB Stack heights: 4mm to 14mm
- 8 sizes: 81 to 528 positions
- Revolutionary, trusted BGA interconnect platform
- High density standard BGA attachment lowers assembly costs by using standard SMT processes
- BGA natural surface tension provides self-alignment and self-leveling for multiple connector usage
- Patented BGA contact attachment preserves solder ball positioning
- Optimized PCB routing enhances electrical performance
- Quality and Reliability
- Time-tested reliability record includes Telcordia GR-1217-CORE and NPS-25298-2 options
- 22+ year solder joint reliability per IPC-SM-785
- 17 Billion + lines shipped to customer satisfaction
- Precious metal plating options satisfy varying customer needs for environmental resistance
