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Conn High Density RCP 296 POS 1.3mm Solder ST SMD Tray, 55701-001, Amphenol

Conn High Density RCP 296 POS 1.3mm Solder ST SMD Tray

Характеристики

Бренд

Base_housing_material

Liquid Crystal Polymer
Schedule_b

8536694040
Specifications

http://www.amphenol-icc.com/media/wysiwyg/files/documentation/datasheet/boardwiretoboard/bwb_gigarray.pdf
Termination_method

Solder
Contact_plating

Gold Over Nickel
Gender

RCP
Body_orientation

Straight
Contact_material

Copper Alloy
Product_length

53.75 mm
Product_dimensions

53.75 x 28.6 x 10.64 mm
Country_of_origin

China
Eccn

EAR99
Htsn

8536694040
Lead_finish

Tin/Lead
Pitch

1.3 mm
Max_processing_temp

260
Mounting

Surface Mount
Артикул: 55701-001

Описание

Conn High Density RCP 296 POS 1.3mm Solder ST SMD Tray

Детали

Бренд

Base_housing_material

Liquid Crystal Polymer
Schedule_b

8536694040
Specifications

http://www.amphenol-icc.com/media/wysiwyg/files/documentation/datasheet/boardwiretoboard/bwb_gigarray.pdf
Termination_method

Solder
Contact_plating

Gold Over Nickel
Gender

RCP
Body_orientation

Straight
Contact_material

Copper Alloy
Product_length

53.75 mm
Product_dimensions

53.75 x 28.6 x 10.64 mm
Country_of_origin

China
Eccn

EAR99
Htsn

8536694040
Lead_finish

Tin/Lead
Pitch

1.3 mm
Max_processing_temp

260
Mounting

Surface Mount

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