Описание
Conn High Density RCP 200Signal/250Ground POS 1.3mm Solder ST Thru-Hole Tray
Conn High Density RCP 200Signal/250Ground POS 1.3mm Solder ST Thru-Hole Tray
| Бренд | |
|---|---|
| Product_length | 38.2 mm |
| Mounting | Through Hole |
| Max_processing_temp | 260 |
| Pitch | 1.3 mm |
| Lead_finish | Tin/Lead |
| Htsn | 8536694040 |
| Eccn | EAR99 |
| Country_of_origin | China |
| Product_dimensions | 38.2 x 25.5 x 14.51 mm |
| Contact_material | Copper Alloy |
| Base_housing_material | Liquid Crystal Polymer |
| Body_orientation | Straight |
| Gender | RCP |
| Contact_plating | Gold Over Nickel |
| Termination_method | Solder |
| Specifications | http://www.amphenol-icc.com/media/wysiwyg/files/documentation/datasheet/boardwiretoboard/bwb_gigarray.pdf |
| Schedule_b | 8536904000 |
| Operating_temperature | -40 to 85 °C |
Conn High Density RCP 200Signal/250Ground POS 1.3mm Solder ST Thru-Hole Tray
| Бренд | |
|---|---|
| Product_length | 38.2 mm |
| Mounting | Through Hole |
| Max_processing_temp | 260 |
| Pitch | 1.3 mm |
| Lead_finish | Tin/Lead |
| Htsn | 8536694040 |
| Eccn | EAR99 |
| Country_of_origin | China |
| Product_dimensions | 38.2 x 25.5 x 14.51 mm |
| Contact_material | Copper Alloy |
| Base_housing_material | Liquid Crystal Polymer |
| Body_orientation | Straight |
| Gender | RCP |
| Contact_plating | Gold Over Nickel |
| Termination_method | Solder |
| Specifications | http://www.amphenol-icc.com/media/wysiwyg/files/documentation/datasheet/boardwiretoboard/bwb_gigarray.pdf |
| Schedule_b | 8536904000 |
| Operating_temperature | -40 to 85 °C |