Conn High Density RCP 200Signal/250Ground POS 1.3mm Solder ST Thru-Hole Tray, 10060912-001, Amphenol

Conn High Density RCP 200Signal/250Ground POS 1.3mm Solder ST Thru-Hole Tray

Характеристики

Бренд

Contact_material

Copper Alloy

Schedule_b

8536904000

Specifications

http://www.amphenol-icc.com/media/wysiwyg/files/documentation/datasheet/boardwiretoboard/bwb_gigarray.pdf

Termination_method

Solder

Contact_plating

Gold Over Nickel

Gender

RCP

Body_orientation

Straight

Base_housing_material

Liquid Crystal Polymer

Product_dimensions

38.2 x 25.5 x 14.51 mm

Product_length

38.2 mm

Country_of_origin

China

Eccn

EAR99

Htsn

8536694040

Lead_finish

Tin/Lead

Pitch

1.3 mm

Max_processing_temp

260

Mounting

Through Hole

Operating_temperature

-40 to 85 °C

Артикул: 10060912-001

Описание

Conn High Density RCP 200Signal/250Ground POS 1.3mm Solder ST Thru-Hole Tray

Детали

Бренд

Contact_material

Copper Alloy

Schedule_b

8536904000

Specifications

http://www.amphenol-icc.com/media/wysiwyg/files/documentation/datasheet/boardwiretoboard/bwb_gigarray.pdf

Termination_method

Solder

Contact_plating

Gold Over Nickel

Gender

RCP

Body_orientation

Straight

Base_housing_material

Liquid Crystal Polymer

Product_dimensions

38.2 x 25.5 x 14.51 mm

Product_length

38.2 mm

Country_of_origin

China

Eccn

EAR99

Htsn

8536694040

Lead_finish

Tin/Lead

Pitch

1.3 mm

Max_processing_temp

260

Mounting

Through Hole

Operating_temperature

-40 to 85 °C