Описание
Conn High Density RCP 200Signal/250Ground POS 1.3mm Solder ST Thru-Hole Tray
Conn High Density RCP 200Signal/250Ground POS 1.3mm Solder ST Thru-Hole Tray
Бренд | |
---|---|
Contact_material | Copper Alloy |
Schedule_b | 8536904000 |
Specifications | http://www.amphenol-icc.com/media/wysiwyg/files/documentation/datasheet/boardwiretoboard/bwb_gigarray.pdf |
Termination_method | Solder |
Contact_plating | Gold Over Nickel |
Gender | RCP |
Body_orientation | Straight |
Base_housing_material | Liquid Crystal Polymer |
Product_dimensions | 38.2 x 25.5 x 14.51 mm |
Product_length | 38.2 mm |
Country_of_origin | China |
Eccn | EAR99 |
Htsn | 8536694040 |
Lead_finish | Tin/Lead |
Pitch | 1.3 mm |
Max_processing_temp | 260 |
Mounting | Through Hole |
Operating_temperature | -40 to 85 °C |
Conn High Density RCP 200Signal/250Ground POS 1.3mm Solder ST Thru-Hole Tray
Бренд | |
---|---|
Contact_material | Copper Alloy |
Schedule_b | 8536904000 |
Specifications | http://www.amphenol-icc.com/media/wysiwyg/files/documentation/datasheet/boardwiretoboard/bwb_gigarray.pdf |
Termination_method | Solder |
Contact_plating | Gold Over Nickel |
Gender | RCP |
Body_orientation | Straight |
Base_housing_material | Liquid Crystal Polymer |
Product_dimensions | 38.2 x 25.5 x 14.51 mm |
Product_length | 38.2 mm |
Country_of_origin | China |
Eccn | EAR99 |
Htsn | 8536694040 |
Lead_finish | Tin/Lead |
Pitch | 1.3 mm |
Max_processing_temp | 260 |
Mounting | Through Hole |
Operating_temperature | -40 to 85 °C |