Description
Conn High Density RCP 200 POS 1.3mm Solder ST SMD
Conn High Density RCP 200 POS 1.3mm Solder ST SMD, 55740-001, Amphenol
Conn High Density RCP 200 POS 1.3mm Solder ST SMD
Характеристики
| Бренд | |
|---|---|
| Base_housing_material | Liquid Crystal Polymer |
| Schedule_b | 8536694040 |
| Specifications | http://www.amphenol-icc.com/media/wysiwyg/files/documentation/datasheet/boardwiretoboard/bwb_gigarray.pdf |
| Termination_method | Solder |
| Contact_plating | Gold Over Nickel |
| Gender | RCP |
| Body_orientation | Straight |
| Contact_material | Copper Alloy |
| Product_length | 38.2 mm |
| Product_dimensions | 38.2 x 28.6 x 11.19 mm |
| Country_of_origin | China |
| Eccn | EAR99 |
| Htsn | 8536694040 |
| Lead_finish | Tin/Lead |
| Pitch | 1.3000 mm |
| Max_processing_temp | 260 |
| Mounting | Surface Mount |
SKU: 55740-001
Additional information
| Бренд | |
|---|---|
| Base_housing_material | Liquid Crystal Polymer |
| Schedule_b | 8536694040 |
| Specifications | http://www.amphenol-icc.com/media/wysiwyg/files/documentation/datasheet/boardwiretoboard/bwb_gigarray.pdf |
| Termination_method | Solder |
| Contact_plating | Gold Over Nickel |
| Gender | RCP |
| Body_orientation | Straight |
| Contact_material | Copper Alloy |
| Product_length | 38.2 mm |
| Product_dimensions | 38.2 x 28.6 x 11.19 mm |
| Country_of_origin | China |
| Eccn | EAR99 |
| Htsn | 8536694040 |
| Lead_finish | Tin/Lead |
| Pitch | 1.3000 mm |
| Max_processing_temp | 260 |
| Mounting | Surface Mount |
