Conn High Density RCP 120 POS 2mm Press Fit ST Thru-Hole, 10052842-101LF, Amphenol

The AirMax VS connectors use innovative edge-coupling and air dielectric between adjacent conductors to deliver insertion loss and crosstalk. This technology, invented by FCI, enabled low cost, high performance connectors that are a leading backplane interconnect solution for telecom, networking, server, and storage applications.The shieldless Open Pin Field Design with no pre-assigned ground pins provides the ultimate flexibility in board layout. The AirMax VS connectors addresse a broad range of system architectures, including backplane, midplane, coplanar, midplane orthogonal, cabled backplane, and mezzanine applications.This is a broad, high volume product family that system continues to earn business when competing with the many more expensive and complex shielded connector systems. This is due in part because of its high density, simple modular construction and low cost.Further enhancements of the AirMax product family are seeing speeds increase up to 25Gb/s, enabling customers to design electronic systems that are highly functional and cost effective. This enables backward compatibility with legacy systems and forward compatibility with the most advanced designs.

  • Innovative shieldless design and air dielectric between adjacent conductors
  • Open Pin Field Design
  • Connector available in modules with 4 pairs per column. 85 ohm versions also available
  • Backward mating-compatible interface
  • AirMax signal, power, and guidance modules in stock at most distributors
  • Available with headers or receptacles on the backplane
  • Adopted by multiple industry standard architectures, including Storage Bridge Bay and Serial CPCI
  • Innovative shieldless edge couple technology and air dielectric between adjacent conductors

Характеристики

Бренд

Base_housing_material

Thermoplastic

Schedule_b

8536694040

Specifications

http://www.amphenol-icc.com/media/wysiwyg/files/documentation/datasheet/backplane/bpl_airmax_midplane.pdf

Termination_method

Press Fit

Contact_plating

Gold Over Nickel

Gender

RCP

Body_orientation

Straight

Number_of_rows

12

Housing_color

Natural

Contact_material

Copper Alloy

Number_of_contacts

120 POS

Product_dimensions

18.9 x 15.9 x 10.7 mm

Product_length

18.9 mm

Kind

High Density

Country_of_origin

Malaysia

Eccn

EAR99

Htsn

8536694040

Lead_finish

Tin

Pitch

2.0000 mm

Max_processing_temp

260

Mounting

Through Hole

Артикул: 10052842-101LF

Описание

The AirMax VS connectors use innovative edge-coupling and air dielectric between adjacent conductors to deliver insertion loss and crosstalk. This technology, invented by FCI, enabled low cost, high performance connectors that are a leading backplane interconnect solution for telecom, networking, server, and storage applications.The shieldless Open Pin Field Design with no pre-assigned ground pins provides the ultimate flexibility in board layout. The AirMax VS connectors addresse a broad range of system architectures, including backplane, midplane, coplanar, midplane orthogonal, cabled backplane, and mezzanine applications.This is a broad, high volume product family that system continues to earn business when competing with the many more expensive and complex shielded connector systems. This is due in part because of its high density, simple modular construction and low cost.Further enhancements of the AirMax product family are seeing speeds increase up to 25Gb/s, enabling customers to design electronic systems that are highly functional and cost effective. This enables backward compatibility with legacy systems and forward compatibility with the most advanced designs.

  • Innovative shieldless design and air dielectric between adjacent conductors
  • Open Pin Field Design
  • Connector available in modules with 4 pairs per column. 85 ohm versions also available
  • Backward mating-compatible interface
  • AirMax signal, power, and guidance modules in stock at most distributors
  • Available with headers or receptacles on the backplane
  • Adopted by multiple industry standard architectures, including Storage Bridge Bay and Serial CPCI
  • Innovative shieldless edge couple technology and air dielectric between adjacent conductors

Детали

Бренд

Base_housing_material

Thermoplastic

Schedule_b

8536694040

Specifications

http://www.amphenol-icc.com/media/wysiwyg/files/documentation/datasheet/backplane/bpl_airmax_midplane.pdf

Termination_method

Press Fit

Contact_plating

Gold Over Nickel

Gender

RCP

Body_orientation

Straight

Number_of_rows

12

Housing_color

Natural

Contact_material

Copper Alloy

Number_of_contacts

120 POS

Product_dimensions

18.9 x 15.9 x 10.7 mm

Product_length

18.9 mm

Kind

High Density

Country_of_origin

Malaysia

Eccn

EAR99

Htsn

8536694040

Lead_finish

Tin

Pitch

2.0000 mm

Max_processing_temp

260

Mounting

Through Hole