Описание
Conn High Density PL 528 POS 1.27mm Solder ST SMD T/R
Conn High Density PL 528 POS 1.27mm Solder ST SMD T/R, 10022671-202, Amphenol
Conn High Density PL 528 POS 1.27mm Solder ST SMD T/R
Характеристики
| Бренд | |
|---|---|
| Product_dimensions | 61.88 x 19.88 x 4.37 mm |
| Schedule_b | 8536694040 |
| Specifications | http://www.amphenol-icc.com/media/wysiwyg/files/documentation/datasheet/boardwiretoboard/bwb_megarray_mezzanine.pdf |
| Termination_method | Solder |
| Contact_plating | Gold Over Nickel |
| Gender | PL |
| Body_orientation | Straight |
| Number_of_rows | 12 |
| Base_housing_material | Liquid Crystal Polymer |
| Contact_material | Copper Alloy |
| Max_voltage_rating | 200 Vac |
| Number_of_contacts | 528 POS |
| Product_length | 61.88 mm |
| Country_of_origin | United States |
| Eccn | EAR99 |
| Htsn | 8536694040 |
| Lead_finish | Tin/Lead |
| Pitch | 1.2700 mm |
| Max_processing_temp | 260 |
| Mounting | Surface Mount |
| Operating_temperature | -40 to 85 °C |
Артикул: 10022671-202
Детали
| Бренд | |
|---|---|
| Product_dimensions | 61.88 x 19.88 x 4.37 mm |
| Schedule_b | 8536694040 |
| Specifications | http://www.amphenol-icc.com/media/wysiwyg/files/documentation/datasheet/boardwiretoboard/bwb_megarray_mezzanine.pdf |
| Termination_method | Solder |
| Contact_plating | Gold Over Nickel |
| Gender | PL |
| Body_orientation | Straight |
| Number_of_rows | 12 |
| Base_housing_material | Liquid Crystal Polymer |
| Contact_material | Copper Alloy |
| Max_voltage_rating | 200 Vac |
| Number_of_contacts | 528 POS |
| Product_length | 61.88 mm |
| Country_of_origin | United States |
| Eccn | EAR99 |
| Htsn | 8536694040 |
| Lead_finish | Tin/Lead |
| Pitch | 1.2700 mm |
| Max_processing_temp | 260 |
| Mounting | Surface Mount |
| Operating_temperature | -40 to 85 °C |
