Описание
Conn High Density PL 300 POS 1.27mm Solder ST Thru-Hole T/R
Conn High Density PL 300 POS 1.27mm Solder ST Thru-Hole T/R
| Бренд | |
|---|---|
| Product_length | 44.1 mm |
| Mounting | Through Hole |
| Max_processing_temp | 260 |
| Pitch | 1.27 mm |
| Lead_finish | Tin/Lead |
| Htsn | 8536694040 |
| Eccn | EAR99 |
| Country_of_origin | United States |
| Product_dimensions | 44.1 x 17.34 x 3.35 mm |
| Contact_material | Copper Alloy |
| Base_housing_material | Liquid Crystal Polymer |
| Body_orientation | Straight |
| Gender | PL |
| Contact_plating | Gold Over Nickel |
| Termination_method | Solder |
| Specifications | http://www.amphenol-icc.com/media/wysiwyg/files/documentation/datasheet/boardwiretoboard/bwb_megarray_mezzanine.pdf |
| Schedule_b | 8536694040 |
| Operating_temperature | -40 to 85 °C |
Conn High Density PL 300 POS 1.27mm Solder ST Thru-Hole T/R
| Бренд | |
|---|---|
| Product_length | 44.1 mm |
| Mounting | Through Hole |
| Max_processing_temp | 260 |
| Pitch | 1.27 mm |
| Lead_finish | Tin/Lead |
| Htsn | 8536694040 |
| Eccn | EAR99 |
| Country_of_origin | United States |
| Product_dimensions | 44.1 x 17.34 x 3.35 mm |
| Contact_material | Copper Alloy |
| Base_housing_material | Liquid Crystal Polymer |
| Body_orientation | Straight |
| Gender | PL |
| Contact_plating | Gold Over Nickel |
| Termination_method | Solder |
| Specifications | http://www.amphenol-icc.com/media/wysiwyg/files/documentation/datasheet/boardwiretoboard/bwb_megarray_mezzanine.pdf |
| Schedule_b | 8536694040 |
| Operating_temperature | -40 to 85 °C |