Описание
Conn High Density PL 296Signal/370Ground POS 1.3mm Solder ST Thru-Hole Tray
Conn High Density PL 296Signal/370Ground POS 1.3mm Solder ST Thru-Hole Tray
Бренд | |
---|---|
Base_housing_material | Liquid Crystal Polymer |
Schedule_b | 8536694040 |
Specifications | http://www.amphenol-icc.com/media/wysiwyg/files/documentation/datasheet/boardwiretoboard/bwb_gigarray.pdf |
Termination_method | Solder |
Contact_plating | Gold Over Nickel |
Gender | PL |
Body_orientation | Straight |
Contact_material | Copper Alloy |
Product_length | 53.75 mm |
Product_dimensions | 53.75 x 25.5 x 12.64 mm |
Country_of_origin | China |
Eccn | EAR99 |
Htsn | 8536694040 |
Lead_finish | Tin/Silver/Copper |
Pitch | 1.3000 mm |
Mounting | Through Hole |
Operating_temperature | -40 to 85 °C |
Conn High Density PL 296Signal/370Ground POS 1.3mm Solder ST Thru-Hole Tray
Бренд | |
---|---|
Base_housing_material | Liquid Crystal Polymer |
Schedule_b | 8536694040 |
Specifications | http://www.amphenol-icc.com/media/wysiwyg/files/documentation/datasheet/boardwiretoboard/bwb_gigarray.pdf |
Termination_method | Solder |
Contact_plating | Gold Over Nickel |
Gender | PL |
Body_orientation | Straight |
Contact_material | Copper Alloy |
Product_length | 53.75 mm |
Product_dimensions | 53.75 x 25.5 x 12.64 mm |
Country_of_origin | China |
Eccn | EAR99 |
Htsn | 8536694040 |
Lead_finish | Tin/Silver/Copper |
Pitch | 1.3000 mm |
Mounting | Through Hole |
Operating_temperature | -40 to 85 °C |