Описание
Conn High Density PL 200 POS Solder ST SMD Tray
Conn High Density PL 200 POS Solder ST SMD Tray
| Бренд | |
|---|---|
| Product_length | 38.15 mm |
| Max_processing_temp | 260 |
| Lead_finish | Tin/Lead |
| Htsn | 8536694040 |
| Eccn | EAR99 |
| Country_of_origin | China |
| Kind | High Density |
| Product_dimensions | 38.15 x 25.5 mm |
| Contact_material | Copper Alloy |
| Base_housing_material | Liquid Crystal Polymer |
| Body_orientation | Straight |
| Gender | PL |
| Contact_plating | Gold Over Nickel |
| Termination_method | Solder |
| Specifications | http://www.amphenol-icc.com/media/wysiwyg/files/documentation/datasheet/boardwiretoboard/bwb_gigarray.pdf |
| Schedule_b | 8536694040 |
| Mounting | Surface Mount |
Conn High Density PL 200 POS Solder ST SMD Tray
| Бренд | |
|---|---|
| Product_length | 38.15 mm |
| Max_processing_temp | 260 |
| Lead_finish | Tin/Lead |
| Htsn | 8536694040 |
| Eccn | EAR99 |
| Country_of_origin | China |
| Kind | High Density |
| Product_dimensions | 38.15 x 25.5 mm |
| Contact_material | Copper Alloy |
| Base_housing_material | Liquid Crystal Polymer |
| Body_orientation | Straight |
| Gender | PL |
| Contact_plating | Gold Over Nickel |
| Termination_method | Solder |
| Specifications | http://www.amphenol-icc.com/media/wysiwyg/files/documentation/datasheet/boardwiretoboard/bwb_gigarray.pdf |
| Schedule_b | 8536694040 |
| Mounting | Surface Mount |