Описание
Conn High Density PL 200 POS 1.3mm Solder ST SMD Tray
Conn High Density PL 200 POS 1.3mm Solder ST SMD Tray
Бренд | |
---|---|
Contact_material | Copper Alloy |
Schedule_b | 8536694040 |
Specifications | http://www.amphenol-icc.com/media/wysiwyg/files/documentation/datasheet/boardwiretoboard/bwb_gigarray.pdf |
Termination_method | Solder |
Contact_plating | Gold Over Nickel |
Gender | PL |
Body_orientation | Straight |
Number_of_rows | 10 |
Base_housing_material | Liquid Crystal Polymer |
Product_dimensions | 38.2 x 28.6 x 20.94 mm |
Number_of_contacts | 200 POS |
Max_voltage_rating | 500 Vac |
Product_length | 38.2 mm |
Kind | High Density |
Country_of_origin | China |
Eccn | EAR99 |
Htsn | 8536694040 |
Pitch | 1.3 mm |
Max_processing_temp | 260 |
Mounting | Surface Mount |
Conn High Density PL 200 POS 1.3mm Solder ST SMD Tray
Бренд | |
---|---|
Contact_material | Copper Alloy |
Schedule_b | 8536694040 |
Specifications | http://www.amphenol-icc.com/media/wysiwyg/files/documentation/datasheet/boardwiretoboard/bwb_gigarray.pdf |
Termination_method | Solder |
Contact_plating | Gold Over Nickel |
Gender | PL |
Body_orientation | Straight |
Number_of_rows | 10 |
Base_housing_material | Liquid Crystal Polymer |
Product_dimensions | 38.2 x 28.6 x 20.94 mm |
Number_of_contacts | 200 POS |
Max_voltage_rating | 500 Vac |
Product_length | 38.2 mm |
Kind | High Density |
Country_of_origin | China |
Eccn | EAR99 |
Htsn | 8536694040 |
Pitch | 1.3 mm |
Max_processing_temp | 260 |
Mounting | Surface Mount |