Описание
Conn High Density PL 200 POS 1.3mm Solder ST SMD Tray
Conn High Density PL 200 POS 1.3mm Solder ST SMD Tray
| Бренд | |
|---|---|
| Schedule_b | 8536694040 |
| Specifications | http://www.amphenol-icc.com/media/wysiwyg/files/documentation/datasheet/boardwiretoboard/bwb_gigarray.pdf |
| Number_of_rows | 8 |
| Base_housing_material | Liquid Crystal Polymer |
| Product_dimensions | 38.2 x 28.6 x 10.95 mm |
| Number_of_contacts | 200 POS |
| Max_voltage_rating | 500 Vac |
| Product_length | 38.2 mm |
| Kind | High Density |
| Country_of_origin | China |
| Eccn | EAR99 |
| Htsn | 8536694040 |
| Lead_finish | Tin/Silver/Copper |
| Pitch | 1.3000 mm |
Conn High Density PL 200 POS 1.3mm Solder ST SMD Tray
| Бренд | |
|---|---|
| Schedule_b | 8536694040 |
| Specifications | http://www.amphenol-icc.com/media/wysiwyg/files/documentation/datasheet/boardwiretoboard/bwb_gigarray.pdf |
| Number_of_rows | 8 |
| Base_housing_material | Liquid Crystal Polymer |
| Product_dimensions | 38.2 x 28.6 x 10.95 mm |
| Number_of_contacts | 200 POS |
| Max_voltage_rating | 500 Vac |
| Product_length | 38.2 mm |
| Kind | High Density |
| Country_of_origin | China |
| Eccn | EAR99 |
| Htsn | 8536694040 |
| Lead_finish | Tin/Silver/Copper |
| Pitch | 1.3000 mm |