Conn High Density HDR 216 POS 1.8mm Press Fit ST Thru-Hole, 10080638-101LF, Amphenol

The ZipLine connector system addresses customer demand for maximum signal density – a paramount requirement for future equipment platforms – at data rates up to 12.5Gb/s.The initial ZipLine signal modules with 1.8mm column pitch support backplane and orthogonal midplane applications. A module with 72 differential pairs provides the maximum density available by delivering 84.6 differential pairs per inch of card edge. Allowing a minimum 1-inch card slot pitch, the compact module dimensions help system designers address mechanical and thermal concerns. ZipLine connectors can also be configured on 1.5mm column pitch to provide more than 100 signal pairs per inch of card edge for even more backplane signal density.

  • Modules with 6 differential pairs/column provide maximum linear signal density along card edge: 84.6 differential pairs per inch
  • An optional power wafer with up to 36A capacity can be integrated within a 6-pair module
  • Stainless steel organizer allows use of flat-rock tooling for connector installation
  • Halogen-free signal modules aid efforts to minimize the use of environmentally sensitive materials
  • Available power and guide modules complement signal connector offering

Характеристики

Бренд

Number_of_contacts

216 POS

Max_processing_temp

260

Pitch

1.8000 mm

Lead_finish

Tin

Htsn

8536694030

Eccn

EAR99

Country_of_origin

Malaysia

Kind

High Density

Product_length

26.8 mm

Product_dimensions

26.8 x 23.2 x 12.45 mm

Contact_material

Copper Alloy

Base_housing_material

Thermoplastic

Housing_color

Black

Number_of_rows

12

Body_orientation

Straight

Gender

HDR

Termination_method

Press Fit

Specifications

http://www.amphenol-icc.com/media/wysiwyg/files/documentation/datasheet/backplane/bpl_zipline_vs_backplanemidplane.pdf

Schedule_b

8536694030

Mounting

Through Hole

Артикул: 10080638-101LF

Описание

The ZipLine connector system addresses customer demand for maximum signal density – a paramount requirement for future equipment platforms – at data rates up to 12.5Gb/s.The initial ZipLine signal modules with 1.8mm column pitch support backplane and orthogonal midplane applications. A module with 72 differential pairs provides the maximum density available by delivering 84.6 differential pairs per inch of card edge. Allowing a minimum 1-inch card slot pitch, the compact module dimensions help system designers address mechanical and thermal concerns. ZipLine connectors can also be configured on 1.5mm column pitch to provide more than 100 signal pairs per inch of card edge for even more backplane signal density.

  • Modules with 6 differential pairs/column provide maximum linear signal density along card edge: 84.6 differential pairs per inch
  • An optional power wafer with up to 36A capacity can be integrated within a 6-pair module
  • Stainless steel organizer allows use of flat-rock tooling for connector installation
  • Halogen-free signal modules aid efforts to minimize the use of environmentally sensitive materials
  • Available power and guide modules complement signal connector offering

Детали

Бренд

Number_of_contacts

216 POS

Max_processing_temp

260

Pitch

1.8000 mm

Lead_finish

Tin

Htsn

8536694030

Eccn

EAR99

Country_of_origin

Malaysia

Kind

High Density

Product_length

26.8 mm

Product_dimensions

26.8 x 23.2 x 12.45 mm

Contact_material

Copper Alloy

Base_housing_material

Thermoplastic

Housing_color

Black

Number_of_rows

12

Body_orientation

Straight

Gender

HDR

Termination_method

Press Fit

Specifications

http://www.amphenol-icc.com/media/wysiwyg/files/documentation/datasheet/backplane/bpl_zipline_vs_backplanemidplane.pdf

Schedule_b

8536694030

Mounting

Through Hole