Описание
Since the emergence of orthogonal midplane system architecture, more communications equipment designers are adopting this packaging scheme to accomplish direct, efficient connections between multiple line cards and a common switch or communications card. Vertical daughter cards on one side of a midplane have a direct connection to horizontal add-in cards on the opposite side of the midplane. The orthogonal solution eliminates long, complex traces, via stub effects, simplifies signal links and reduces backplane layer count.FCI has developed high density and performance connectors that meet designer’s requirements for up to 20Gb/s using 72 crossover pairs in a 25 mm card slot configuration.Flexible connector design also enables designers to allocate connector columns to backplane or power wafers for product customization.Tools have also been included to assist the designer.
- Provide capability to support 36 or 72 differential pair crossovers in a single module
- Headers install back-to-back and at 90° to each other
- Header signal pins share vias to provide a direct connection, eliminating the need for connecting traces
- Use the same right-angle receptacle as backplane, midplane, or coplanar applications
- Flexible design allows columns to be allocated to backplane or power wafers for product customization
- Halogen-free connectors aid efforts to minimize the use of environmentally sensitive materials
- Use the same power and guide modules as backplane or midplane applications
