Conn Backplane RCP 90 POS 2mm Press Fit ST Thru-Hole, 10120759-101LF, Amphenol

Next-generation AirMax VSe connectors provide a migration path for up to 25Gb/s per differential pair with the flexibility of an open pin field design. The connectors also feature backwards mating-compatible interfaces to existing AirMax VS connectors with minimal changes to connector footprints.The connectors combine FCI technologies for a shieldless design with no metallic plates and closely edge-coupled differential pairs with innovative design improvements to yield low loss and low crosstalk.Right angle receptacles and right angle headers will support backplane, midplane or coplanar applications. The mating-compatible interfaces and capability to preserve critical pin assignments can provide opportunities for cost savings as new or upgraded equipment is deployed. For example, a backplane or chassis can be designed to allow the installation and continued use of legacy daughter cards, line cards or blades that are already in the field as well as new or future higher-speed module cards.

  • Provides a migration path for up to 25Gb/s per differential pair
  • Shieldless design with closely coupled pairs
  • Backward mateable to existing AirMax VS® and AirMax VS2® designs
  • 3 pair backplane and coplanar versions are available
  • Hard metric design practice

Характеристики

Бренд

Contact_material

Copper Alloy

Schedule_b

8536904000

Specifications

http://www.amphenol-icc.com/media/wysiwyg/files/documentation/datasheet/backplane/bpl_airmax_vse.pdf

Termination_method

Press Fit

Contact_plating

Gold Over Nickel

Gender

RCP

Body_orientation

Straight

Number_of_rows

10

Housing_color

Black

Base_housing_material

Thermoplastic

Product_dimensions

19.9 x 15.5 x 10.7

Number_of_contacts

90 POS

Max_contact_resistance

35 MOhm

Voltage_rating

500 Vac

Product_length

19.9 mm

Kind

Backplane

Country_of_origin

Malaysia

Eccn

EAR99

Family

10120759

Htsn

8536694040

Lead_finish

Tin Over Nickel

Pitch

2.0000 mm

Max_processing_temp

260 °C

Mounting

Through Hole

Operating_temperature

-55 to 85 °C

Pin_count

90

Артикул: 10120759-101LF

Описание

Next-generation AirMax VSe connectors provide a migration path for up to 25Gb/s per differential pair with the flexibility of an open pin field design. The connectors also feature backwards mating-compatible interfaces to existing AirMax VS connectors with minimal changes to connector footprints.The connectors combine FCI technologies for a shieldless design with no metallic plates and closely edge-coupled differential pairs with innovative design improvements to yield low loss and low crosstalk.Right angle receptacles and right angle headers will support backplane, midplane or coplanar applications. The mating-compatible interfaces and capability to preserve critical pin assignments can provide opportunities for cost savings as new or upgraded equipment is deployed. For example, a backplane or chassis can be designed to allow the installation and continued use of legacy daughter cards, line cards or blades that are already in the field as well as new or future higher-speed module cards.

  • Provides a migration path for up to 25Gb/s per differential pair
  • Shieldless design with closely coupled pairs
  • Backward mateable to existing AirMax VS® and AirMax VS2® designs
  • 3 pair backplane and coplanar versions are available
  • Hard metric design practice

Детали

Бренд

Contact_material

Copper Alloy

Schedule_b

8536904000

Specifications

http://www.amphenol-icc.com/media/wysiwyg/files/documentation/datasheet/backplane/bpl_airmax_vse.pdf

Termination_method

Press Fit

Contact_plating

Gold Over Nickel

Gender

RCP

Body_orientation

Straight

Number_of_rows

10

Housing_color

Black

Base_housing_material

Thermoplastic

Product_dimensions

19.9 x 15.5 x 10.7

Number_of_contacts

90 POS

Max_contact_resistance

35 MOhm

Voltage_rating

500 Vac

Product_length

19.9 mm

Kind

Backplane

Country_of_origin

Malaysia

Eccn

EAR99

Family

10120759

Htsn

8536694040

Lead_finish

Tin Over Nickel

Pitch

2.0000 mm

Max_processing_temp

260 °C

Mounting

Through Hole

Operating_temperature

-55 to 85 °C

Pin_count

90