Описание
Conn Backplane RCP 200 POS 1.3mm Solder ST SMD Tray
Conn Backplane RCP 200 POS 1.3mm Solder ST SMD Tray, 10081496-201, Amphenol
Conn Backplane RCP 200 POS 1.3mm Solder ST SMD Tray
Характеристики
| Бренд | |
|---|---|
| Contact_material | Copper Alloy |
| Schedule_b | 8536694040 |
| Specifications | http://www.amphenol-icc.com/media/wysiwyg/files/documentation/datasheet/boardwiretoboard/bwb_gigarray.pdf |
| Termination_method | Solder |
| Contact_plating | Gold Over Nickel |
| Gender | RCP |
| Body_orientation | Straight |
| Number_of_rows | 2 |
| Base_housing_material | Liquid Crystal Polymer |
| Product_dimensions | 38.2 x 28.6 x 16.64 mm |
| Number_of_contacts | 200 POS |
| Voltage_rating | 500 Vac |
| Product_length | 38.2 mm |
| Kind | Backplane |
| Country_of_origin | China |
| Eccn | EAR99 |
| Htsn | 8536694040 |
| Lead_finish | Tin |
| Pitch | 1.3000 mm |
| Max_current_rating | 1/Contact A |
| Max_processing_temp | 235 °C |
| Mounting | Surface Mount |
| Operating_temperature | -40 to 85 °C |
| Pin_count | 200 |
Артикул: 10081496-201
Детали
| Бренд | |
|---|---|
| Contact_material | Copper Alloy |
| Schedule_b | 8536694040 |
| Specifications | http://www.amphenol-icc.com/media/wysiwyg/files/documentation/datasheet/boardwiretoboard/bwb_gigarray.pdf |
| Termination_method | Solder |
| Contact_plating | Gold Over Nickel |
| Gender | RCP |
| Body_orientation | Straight |
| Number_of_rows | 2 |
| Base_housing_material | Liquid Crystal Polymer |
| Product_dimensions | 38.2 x 28.6 x 16.64 mm |
| Number_of_contacts | 200 POS |
| Voltage_rating | 500 Vac |
| Product_length | 38.2 mm |
| Kind | Backplane |
| Country_of_origin | China |
| Eccn | EAR99 |
| Htsn | 8536694040 |
| Lead_finish | Tin |
| Pitch | 1.3000 mm |
| Max_current_rating | 1/Contact A |
| Max_processing_temp | 235 °C |
| Mounting | Surface Mount |
| Operating_temperature | -40 to 85 °C |
| Pin_count | 200 |
