Описание
Conn Backplane PL 300 POS 1.27mm Solder ST SMD T/R
Conn Backplane PL 300 POS 1.27mm Solder ST SMD T/R
Бренд | |
---|---|
Contact_material | Copper Alloy |
Schedule_b | 8536694040 |
Specifications | http://www.amphenol-icc.com/media/wysiwyg/files/documentation/datasheet/boardwiretoboard/bwb_megarray_mezzanine.pdf |
Termination_method | Solder |
Contact_plating | Gold Special |
Gender | PL |
Body_orientation | Straight |
Number_of_rows | 10 |
Base_housing_material | Liquid Crystal Polymer |
Product_dimensions | 44.1 x 17.34 x 3.35 |
Number_of_contacts | 300 POS |
Max_contact_resistance | 25 MOhm |
Max_voltage_rating | 200 |
Product_length | 44.1 mm |
Kind | Backplane |
Country_of_origin | United States |
Eccn | EAR99 |
Htsn | 8536694040 |
Lead_finish | Copper, Silver, Tin |
Pitch | 1.27 mm |
Max_current_rating | 0.45 A |
Mounting | Surface Mount |
Operating_temperature | -40 to 85 °C |
Pin_count | 300 |
Conn Backplane PL 300 POS 1.27mm Solder ST SMD T/R
Бренд | |
---|---|
Contact_material | Copper Alloy |
Schedule_b | 8536694040 |
Specifications | http://www.amphenol-icc.com/media/wysiwyg/files/documentation/datasheet/boardwiretoboard/bwb_megarray_mezzanine.pdf |
Termination_method | Solder |
Contact_plating | Gold Special |
Gender | PL |
Body_orientation | Straight |
Number_of_rows | 10 |
Base_housing_material | Liquid Crystal Polymer |
Product_dimensions | 44.1 x 17.34 x 3.35 |
Number_of_contacts | 300 POS |
Max_contact_resistance | 25 MOhm |
Max_voltage_rating | 200 |
Product_length | 44.1 mm |
Kind | Backplane |
Country_of_origin | United States |
Eccn | EAR99 |
Htsn | 8536694040 |
Lead_finish | Copper, Silver, Tin |
Pitch | 1.27 mm |
Max_current_rating | 0.45 A |
Mounting | Surface Mount |
Operating_temperature | -40 to 85 °C |
Pin_count | 300 |