Conn Backplane HDR 240 POS 1.2mm Press Fit RA Thru-Hole, 10124560-12JLF, Amphenol

ExaMAX backplane connector system meets industry specifications requiring higher bandwidth applications from 25Gb/s to 56Gb/s. The optimized connector design delivers superior signal integrity performance resulting in low crosstalk noise and low insertion loss while minimizing channel performance variation for every differential pair. Each signal wafer incorporates an innovative one-piece, embossed ground structure to improve crosstalk performance through 56Gb/s. The simple, functional design contributes to a very cost-effective solution.The innovative beam-on-beam contact interface minimizes residual stub for improved signal integrity performance while providing exceptionally low mating forces ExaMAX optimizes design flexibility by integrating high speed differential signals, low speed signals and power in one connectorExaMAX product family is offered in industry standard packaging options including traditional backplane, coplanar board, orthogonal midplane and orthogonal direct mate, mezzanine and cable to board.

  • Data rates scalable from 25Gb/s to 56Gb/s to support system upgrades without costly redesigns
  • 92O nominal impedance
  • Scalable performance
  • Unique beam-on-beam interface and skew equalized leadframes
  • Hermaphroditic mating interface protects mating beams
  • Modular, hard metric connector block design
  • Zero skew
  • Additional signal pin per column
  • High speed signal PCB hole: 0.36mm (finished hole)
  • Ground pin PCB hole: 0.5mm (finished hole)
  • 12 to 96 differential pair node connector
  • Integrated guide design

Характеристики

Бренд

Max_voltage_rating

50 Vac

Operating_temperature

-55 to 85 °C

Mounting

Through Hole

Max_current_rating

0.5/Contact A

Pitch

1.2000 mm

Lead_finish

Tin Over Nickel

Htsn

8536694040

Eccn

EAR99

Kind

Backplane

Product_length

30.35 mm

Max_contact_resistance

60 MOhm

Contact_material

Copper Alloy

Number_of_contacts

240 POS

Product_dimensions

30.35 x 34.6 x 29.7

Base_housing_material

Thermoplastic

Housing_color

Black

Number_of_rows

20

Body_orientation

Right Angle

Gender

HDR

Termination_method

Press Fit

Specifications

http://www.amphenol-icc.com/media/wysiwyg/files/documentation/datasheet/backplane/bpl_examax_backplane.pdf

Schedule_b

8536694040

Pin_count

240

Артикул: 10124560-12JLF

Описание

ExaMAX backplane connector system meets industry specifications requiring higher bandwidth applications from 25Gb/s to 56Gb/s. The optimized connector design delivers superior signal integrity performance resulting in low crosstalk noise and low insertion loss while minimizing channel performance variation for every differential pair. Each signal wafer incorporates an innovative one-piece, embossed ground structure to improve crosstalk performance through 56Gb/s. The simple, functional design contributes to a very cost-effective solution.The innovative beam-on-beam contact interface minimizes residual stub for improved signal integrity performance while providing exceptionally low mating forces ExaMAX optimizes design flexibility by integrating high speed differential signals, low speed signals and power in one connectorExaMAX product family is offered in industry standard packaging options including traditional backplane, coplanar board, orthogonal midplane and orthogonal direct mate, mezzanine and cable to board.

  • Data rates scalable from 25Gb/s to 56Gb/s to support system upgrades without costly redesigns
  • 92O nominal impedance
  • Scalable performance
  • Unique beam-on-beam interface and skew equalized leadframes
  • Hermaphroditic mating interface protects mating beams
  • Modular, hard metric connector block design
  • Zero skew
  • Additional signal pin per column
  • High speed signal PCB hole: 0.36mm (finished hole)
  • Ground pin PCB hole: 0.5mm (finished hole)
  • 12 to 96 differential pair node connector
  • Integrated guide design

Детали

Бренд

Max_voltage_rating

50 Vac

Operating_temperature

-55 to 85 °C

Mounting

Through Hole

Max_current_rating

0.5/Contact A

Pitch

1.2000 mm

Lead_finish

Tin Over Nickel

Htsn

8536694040

Eccn

EAR99

Kind

Backplane

Product_length

30.35 mm

Max_contact_resistance

60 MOhm

Contact_material

Copper Alloy

Number_of_contacts

240 POS

Product_dimensions

30.35 x 34.6 x 29.7

Base_housing_material

Thermoplastic

Housing_color

Black

Number_of_rows

20

Body_orientation

Right Angle

Gender

HDR

Termination_method

Press Fit

Specifications

http://www.amphenol-icc.com/media/wysiwyg/files/documentation/datasheet/backplane/bpl_examax_backplane.pdf

Schedule_b

8536694040

Pin_count

240