Conn AirMax VS HDR 216 POS 1.8mm Press Fit ST Thru-Hole, 10080640-101LF, Amphenol

The ZipLine connector system addresses customer demand for maximum signal density – a paramount requirement for future equipment platforms – at data rates up to 12.5 Gb/s. The initial ZipLine signal modules with 1.8mm column pitch support backplane and orthogonal midplane applications. A module with 72 differential pairs – consisting of 12 insert-molded lead frame assemblies (IMLAs), each supporting 6 high-speed differential signal pairs – provides the maximum density available by delivering 84.6 differential pairs per inch of card edge. Allowing a minimum 1-inch card slot pitch, the compact module dimensions help system designers address mechanical and thermal concerns. The 6-pair ZipLine signal IMLAs can also be configured on 1.5mm column pitch to provide more than 100 signal pairs per inch of card edge for even more backplane signal density ZipLine connectors use FCI’s proven shield-less technology to deliver low insertion loss and crosstalk without using costly and space-consuming metal shields. Data rates can scale up to 12.5 Gb/s without requiring the redesign of a basic platform. In addition to offering superior signal density and electrical performance, the versatile ZipLine design allows for mixed differential (orthogonal or backplane), single-ended or power pin assignments within a connector. Another unique feature is a special power wafer, with up to 36A capacity, which can be integrated within a module. Complementary guide modules and high-power connector modules are also available. All ZipLine connectors and accessory modules are compatible with Hard Metric (HM) equipment design practice.

  • Supports backplane and orthogonal midplane applications
  • 6-pair modules with IMLAs on 1.8mm column pitch deliver 84.6 differential pairs per inch of card edge while allowing a minimum 1-inch card slot pitch
  • 6-pair modules can also be configured on 1.5mm column pitch to provide >100 pairs per inch for even more density
  • 3-pair configuration is under development to enable use on 15mm card slot pitch
  • Provides maximum signal density available at data rates up to 12.5 Gb/s
  • Use FCI’s shield-less technology to deliver low insertion loss and crosstalk
  • Allows for mixed differential (orthogonal or backplane), single-ended or power pin assignments within a connector
  • A special power wafer, with up to 36A capacity, can be integrated within a 6-pair module
  • Compatible with Hard Metric equipment practice

Характеристики

Бренд

Schedule_b

8536694030

Specifications

http://www.amphenol-icc.com/media/wysiwyg/files/documentation/datasheet/backplane/bpl_zipline_orthogonal_midplane.pdf

Number_of_rows

12

Base_housing_material

Thermoplastic

Product_dimensions

26.8 x 23.2 x 12.45 mm

Number_of_contacts

216 POS

Product_length

26.8 mm

Kind

AirMax VS

Country_of_origin

Malaysia

Eccn

EAR99

Htsn

8536694030

Lead_finish

Tin

Артикул: 10080640-101LF

Описание

The ZipLine connector system addresses customer demand for maximum signal density – a paramount requirement for future equipment platforms – at data rates up to 12.5 Gb/s. The initial ZipLine signal modules with 1.8mm column pitch support backplane and orthogonal midplane applications. A module with 72 differential pairs – consisting of 12 insert-molded lead frame assemblies (IMLAs), each supporting 6 high-speed differential signal pairs – provides the maximum density available by delivering 84.6 differential pairs per inch of card edge. Allowing a minimum 1-inch card slot pitch, the compact module dimensions help system designers address mechanical and thermal concerns. The 6-pair ZipLine signal IMLAs can also be configured on 1.5mm column pitch to provide more than 100 signal pairs per inch of card edge for even more backplane signal density ZipLine connectors use FCI’s proven shield-less technology to deliver low insertion loss and crosstalk without using costly and space-consuming metal shields. Data rates can scale up to 12.5 Gb/s without requiring the redesign of a basic platform. In addition to offering superior signal density and electrical performance, the versatile ZipLine design allows for mixed differential (orthogonal or backplane), single-ended or power pin assignments within a connector. Another unique feature is a special power wafer, with up to 36A capacity, which can be integrated within a module. Complementary guide modules and high-power connector modules are also available. All ZipLine connectors and accessory modules are compatible with Hard Metric (HM) equipment design practice.

  • Supports backplane and orthogonal midplane applications
  • 6-pair modules with IMLAs on 1.8mm column pitch deliver 84.6 differential pairs per inch of card edge while allowing a minimum 1-inch card slot pitch
  • 6-pair modules can also be configured on 1.5mm column pitch to provide >100 pairs per inch for even more density
  • 3-pair configuration is under development to enable use on 15mm card slot pitch
  • Provides maximum signal density available at data rates up to 12.5 Gb/s
  • Use FCI’s shield-less technology to deliver low insertion loss and crosstalk
  • Allows for mixed differential (orthogonal or backplane), single-ended or power pin assignments within a connector
  • A special power wafer, with up to 36A capacity, can be integrated within a 6-pair module
  • Compatible with Hard Metric equipment practice

Детали

Бренд

Schedule_b

8536694030

Specifications

http://www.amphenol-icc.com/media/wysiwyg/files/documentation/datasheet/backplane/bpl_zipline_orthogonal_midplane.pdf

Number_of_rows

12

Base_housing_material

Thermoplastic

Product_dimensions

26.8 x 23.2 x 12.45 mm

Number_of_contacts

216 POS

Product_length

26.8 mm

Kind

AirMax VS

Country_of_origin

Malaysia

Eccn

EAR99

Htsn

8536694030

Lead_finish

Tin