Audio Amp Headphone/Speaker 1-CH Mono/2-CH Stereo 0.7W Class-AB 8-Pin HTSSOP EP Tube, TPA711DGN, Texas Instruments

The TPA711 is a bridge-tied load (BTL) or single-ended (SE) audio power amplifier developed especially for low-voltage applications where internal speakers and external earphone operation are required. Operating with a 3.3-V supply, the TPA711 can deliver 250-mW of continuous power into a BTL 😯 load at less than 0.6% THD+N throughout voice band frequencies. Although this device is characterized out to 20 kHz, its operation is optimized for narrower band applications such as wireless communications. The BTL configuration eliminates the need for external coupling capacitors on the output in most applications, which is particularly important for small battery-powered equipment. A unique feature of the TPA711 is that it allows the amplifier to switch from BTL to SE on the fly when an earphone drive is required. This eliminates complicated mechanical switching or auxiliary devices just to drive the external load. This device features a shutdown mode for power-sensitive applications with special depop circuitry to eliminate speaker noise when exiting shutdown mode. The TPA711 is available in an 8-pin SOIC and the surface-mount PowerPAD MSOP package, which reduces board space by 50% and height by 40%.

  • Fully Specified for 3.3-V and 5-V Operation
  • Wide Power Supply Compatibility 2.5 V – 5.5 V
  • Output Power
    • 700 mW at VDD = 5 V, BTL, RL = 8 O
    • 85 mW at VDD = 5 V, SE, RL = 32 O
    • 250 mW at VDD = 3.3 V, BTL, RL = 8 O
    • 37 mW at VDD = 3.3 V, SE, RL = 32 O
  • Shutdown Control
    • IDD = 7 uA at 3.3 V
    • IDD = 50 uA at 5 V
  • BTL to SE Mode Control
  • Integrated Depop Circuitry
  • Thermal and Short-Circuit Protection
  • Surface-Mount Packaging
    • SOIC
    • PowerPAD™ MSOP
  • Характеристики

    Бренд

    Typical_psrr

    78 dB

    Typ_output_power_x_chan_load

    0.085×2@32Ohm W, 0.7×1@8Ohm

    Totl_harmon_distortion_noise

    0.5@8Ohm@700mW %

    Amplifier_type

    Class-AB

    Max_load_resistance

    32 Ohm

    Typ_gain_bandwidth_product

    1.4 MHz

    Specifications

    http://www.ti.com/general/docs/lit/getliterature.tsp?genericPartNumber=TPA711&&fileType=pdf

    Supplier_package

    HTSSOP EP

    Country_of_origin

    United States

    Eccn

    EAR99

    Функция

    Headphone/Speaker

    Htsn

    8542330001

    Input_signal_type

    Single

    Lead_finish

    Gold

    Max_power_dissipation

    2140 mW

    Max_processing_temp

    260

    Mounting

    Surface Mount

    Schedule_b

    8542330000

    Msl_level

    1

    Operating_supply_current

    2.5@5V mA

    Operating_temperature

    -40 to 85 °C

    Output_signal_type

    Differential, Single-Ended

    Output_type

    1-Channel Mono, 2-Channel Stereo

    Pin_count

    8

    Power_supply_type

    Single

    Product_dimensions

    3 x 3 x 1.02 mm

    Артикул: TPA711DGN

    Описание

    The TPA711 is a bridge-tied load (BTL) or single-ended (SE) audio power amplifier developed especially for low-voltage applications where internal speakers and external earphone operation are required. Operating with a 3.3-V supply, the TPA711 can deliver 250-mW of continuous power into a BTL 😯 load at less than 0.6% THD+N throughout voice band frequencies. Although this device is characterized out to 20 kHz, its operation is optimized for narrower band applications such as wireless communications. The BTL configuration eliminates the need for external coupling capacitors on the output in most applications, which is particularly important for small battery-powered equipment. A unique feature of the TPA711 is that it allows the amplifier to switch from BTL to SE on the fly when an earphone drive is required. This eliminates complicated mechanical switching or auxiliary devices just to drive the external load. This device features a shutdown mode for power-sensitive applications with special depop circuitry to eliminate speaker noise when exiting shutdown mode. The TPA711 is available in an 8-pin SOIC and the surface-mount PowerPAD MSOP package, which reduces board space by 50% and height by 40%.

  • Fully Specified for 3.3-V and 5-V Operation
  • Wide Power Supply Compatibility 2.5 V – 5.5 V
  • Output Power
    • 700 mW at VDD = 5 V, BTL, RL = 8 O
    • 85 mW at VDD = 5 V, SE, RL = 32 O
    • 250 mW at VDD = 3.3 V, BTL, RL = 8 O
    • 37 mW at VDD = 3.3 V, SE, RL = 32 O
  • Shutdown Control
    • IDD = 7 uA at 3.3 V
    • IDD = 50 uA at 5 V
  • BTL to SE Mode Control
  • Integrated Depop Circuitry
  • Thermal and Short-Circuit Protection
  • Surface-Mount Packaging
    • SOIC
    • PowerPAD™ MSOP
  • Детали

    Бренд

    Typical_psrr

    78 dB

    Typ_output_power_x_chan_load

    0.085×2@32Ohm W, 0.7×1@8Ohm

    Totl_harmon_distortion_noise

    0.5@8Ohm@700mW %

    Amplifier_type

    Class-AB

    Max_load_resistance

    32 Ohm

    Typ_gain_bandwidth_product

    1.4 MHz

    Specifications

    http://www.ti.com/general/docs/lit/getliterature.tsp?genericPartNumber=TPA711&&fileType=pdf

    Supplier_package

    HTSSOP EP

    Country_of_origin

    United States

    Eccn

    EAR99

    Функция

    Headphone/Speaker

    Htsn

    8542330001

    Input_signal_type

    Single

    Lead_finish

    Gold

    Max_power_dissipation

    2140 mW

    Max_processing_temp

    260

    Mounting

    Surface Mount

    Schedule_b

    8542330000

    Msl_level

    1

    Operating_supply_current

    2.5@5V mA

    Operating_temperature

    -40 to 85 °C

    Output_signal_type

    Differential, Single-Ended

    Output_type

    1-Channel Mono, 2-Channel Stereo

    Pin_count

    8

    Power_supply_type

    Single

    Product_dimensions

    3 x 3 x 1.02 mm