B2B commodity marketplace

FPGA Artix-7 33280 Cells 28nm Technology 1V 324-Pin CS-BGA Tray

The XA Artix-7 (Automotive) FPGAs are optimized for the lowest cost and power with small form-factor packaging for high-volume automotive applications. Designers can leverage more logic per watt compared to the Spartan-6 family.Built on a state-of-the-art high-performance/low-power (HPL) 28 nm high-k metal gate (HKMG) process technology, XA Artix-7 FPGAs redefine low-cost alternatives with more logic per watt. Unparalleled increase in system performance with 52 Gb/s I/O bandwidth, 100,000 logic cell capacity, 264 GMAC/s DSP, and flexible built-in DDR3 memory interfaces enable a new class of high-throughput, low-cost automotive applications. XA Artix-7 FPGAs also offer many high-end features, such as integrated advanced Analog Mixed Signal (AMS) technology. Analog becomes the next level of integration through the seamless implementation of independent dual 12-bit, 1 MSPS, 17-channel analog-to-digital converters. Most importantly, XA Artix-7 FPGAs proudly meet the high standards of the automotive grade with a maximum temperature of 125°C.
  • Automotive Temperatures:
    • I-Grade: Tj= -40°C to +100°C
    • Q-Grade: Tj= -40°C to +125°C
  • Automotive Standards:
    • ISO-TS16949 compliant
    • AEC-Q100 qualification
    • Production Part Approval Process (PPAP) documentation
    • Beyond AEC-Q100 qualification is available upon request
  • Advanced high-performance FPGA logic based on real 6-input lookup table (LUT) technology configurable as distributed memory
  • 36 Kb dual-port block RAM with built-in FIFO logic for on-chip data buffering
  • Sub-watt performance in 100,000 logic cells
  • High-performance SelectIO™ technology with support for DDR3 interfaces up to 800 Mb/s
  • High-speed serial connectivity with built-in serial transceivers from 500 Mb/s to maximum rates of 6.25 Gb/s, enabling 50 Gb/s peak bandwidth (full duplex)
  • A user configurable analog interface (XADC), incorporating dual 12-bit 1MSPS analog-to-digital converters with on-chip thermal and supply sensors
  • Single-ended and differential I/O standards with speeds of up to 1.25 Gb/s
  • 240 DSP48E1 slices with up to 264 GMACs of signal processing
  • Powerful clock management tiles (CMT), combining phase-locked loop (PLL) and mixed-mode clock manager (MMCM) blocks for high precision and low jitter
  • Integrated block for PCI Express® (PCIe®), for up to x4 Gen2 Endpoint
  • Wide variety of configuration options, including support for commodity memories, 256-bit AES encryption with HMAC/SHA-256 authentication, and built-in SEU detection and correction
  • Low-cost wire-bond packaging, offering easy migration between family members in the same package, all packages available Pb-free
  • Designed for high performance and lowest power with 28 nm, HKMG, HPL process, 1.0V core voltage process technology
  • Strong automotive-specific third-party ecosystem with IP, development boards, and design services

Specifications

Brand Xilinx
Schedule B 8542390000
HTSN 8542390001
Country of origin Taiwan
Msl Level 3
Lead Finish Tin|Silver|Copper
Operating temperature -40 to 100 °C
Device Lo 33,28
Maximum N 210
Typical O 1.0000 V
Max Proce 260
Product description 15 x 15 x 1.06
Device Lo 33,28
Screening Level Industrial
Re Progra No
Ram Bits 1,843,200 Bit
Supplier CSBGA
Maximum O 1.05 V
Minimum O 0.95 V
Speed Grade 2
Maximum P 0.11 ns
Number Of 41,6
SKU: XA7A35T-2CSG324I