Conn Backplane HDR 240 POS 1.2mm Press Fit RA Thru-Hole, 10124560-101LF, Amphenol

ExaMAX backplane connector system meets industry specifications requiring higher bandwidth applications from 25Gb/s to 56Gb/s. The optimized connector design delivers superior signal integrity performance resulting in low crosstalk noise and low insertion loss while minimizing channel performance variation for every differential pair. Each signal wafer incorporates an innovative one-piece, embossed ground structure to improve crosstalk performance through 56Gb/s. The simple, functional design contributes to a very cost-effective solution.The innovative beam-on-beam contact interface minimizes residual stub for improved signal integrity performance while providing exceptionally low mating forces ExaMAX optimizes design flexibility by integrating high speed differential signals, low speed signals and power in one connectorExaMAX product family is offered in industry standard packaging options including traditional backplane, coplanar board, orthogonal midplane and orthogonal direct mate, mezzanine and cable to board.

  • Data rates scalable from 25Gb/s to 56Gb/s to support system upgrades without costly redesigns
  • 92O nominal impedance
  • Scalable performance
  • Unique beam-on-beam interface and skew equalized leadframes
  • Hermaphroditic mating interface protects mating beams
  • Modular, hard metric connector block design
  • Zero skew
  • Additional signal pin per column
  • High speed signal PCB hole: 0.36mm (finished hole)
  • Ground pin PCB hole: 0.5mm (finished hole)
  • 12 to 96 differential pair node connector
  • Integrated guide design

Характеристики

Бренд

Contact_material

Copper Alloy

Schedule_b

8536694040

Specifications

http://www.amphenol-icc.com/media/wysiwyg/files/documentation/datasheet/backplane/bpl_examax_backplane.pdf

Termination_method

Press Fit

Gender

HDR

Body_orientation

Right Angle

Number_of_rows

20

Housing_color

Black

Base_housing_material

Thermoplastic

Product_dimensions

23.9 x 36.2 x 29.7

Number_of_contacts

240 POS

Max_contact_resistance

60 MOhm

Max_voltage_rating

50 Vac

Product_length

23.9 mm

Kind

Backplane

Country_of_origin

China

Eccn

EAR99

Htsn

8536694040

Lead_finish

Tin Over Nickel

Pitch

1.2000 mm

Max_current_rating

0.5/Contact A

Mounting

Through Hole

Operating_temperature

-55 to 85 °C

Pin_count

240

Артикул: 10124560-101LF

Описание

ExaMAX backplane connector system meets industry specifications requiring higher bandwidth applications from 25Gb/s to 56Gb/s. The optimized connector design delivers superior signal integrity performance resulting in low crosstalk noise and low insertion loss while minimizing channel performance variation for every differential pair. Each signal wafer incorporates an innovative one-piece, embossed ground structure to improve crosstalk performance through 56Gb/s. The simple, functional design contributes to a very cost-effective solution.The innovative beam-on-beam contact interface minimizes residual stub for improved signal integrity performance while providing exceptionally low mating forces ExaMAX optimizes design flexibility by integrating high speed differential signals, low speed signals and power in one connectorExaMAX product family is offered in industry standard packaging options including traditional backplane, coplanar board, orthogonal midplane and orthogonal direct mate, mezzanine and cable to board.

  • Data rates scalable from 25Gb/s to 56Gb/s to support system upgrades without costly redesigns
  • 92O nominal impedance
  • Scalable performance
  • Unique beam-on-beam interface and skew equalized leadframes
  • Hermaphroditic mating interface protects mating beams
  • Modular, hard metric connector block design
  • Zero skew
  • Additional signal pin per column
  • High speed signal PCB hole: 0.36mm (finished hole)
  • Ground pin PCB hole: 0.5mm (finished hole)
  • 12 to 96 differential pair node connector
  • Integrated guide design

Детали

Бренд

Contact_material

Copper Alloy

Schedule_b

8536694040

Specifications

http://www.amphenol-icc.com/media/wysiwyg/files/documentation/datasheet/backplane/bpl_examax_backplane.pdf

Termination_method

Press Fit

Gender

HDR

Body_orientation

Right Angle

Number_of_rows

20

Housing_color

Black

Base_housing_material

Thermoplastic

Product_dimensions

23.9 x 36.2 x 29.7

Number_of_contacts

240 POS

Max_contact_resistance

60 MOhm

Max_voltage_rating

50 Vac

Product_length

23.9 mm

Kind

Backplane

Country_of_origin

China

Eccn

EAR99

Htsn

8536694040

Lead_finish

Tin Over Nickel

Pitch

1.2000 mm

Max_current_rating

0.5/Contact A

Mounting

Through Hole

Operating_temperature

-55 to 85 °C

Pin_count

240